Research on Interconnect-Dominated Floorplanning
Research on Interconnect-Dominated Floorplanning
批准号:
9987678
负责人:
Chung-Kuan Cheng
金额:
$40.09万
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
2000
资助国家:
美国
项目状态:
已结题
起止时间:
2000-08-01 至 2004-07-31
中文摘要
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英文摘要
The project researches interconnect-dominated floorplanning. The floorplanning organizes the topology of wires and the assignment of buffers while placement and routing are structured as supporting tools to fulfill the design requirements. The project includes exploration of the following. Technology Floorplanning: Given a circuit design project, the technology floorplanning identifies the technology that provides the best interconnect capability in terms of cost and performance. Logic Floorplanning with a Hierarchical Design Framework: A logic floorplanning takes advantage of the design hierarchy and derives the effect of interconnect delay. Physical Layout Floorplanning: Physical layout floorplanning serves as a foundation to support the interconnect optimization operations.
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