SHF: Small: Efficient Test and Yield Enhancement Techniques for 3D Integrated Circuits

采用硅通孔(TSV)的三维集成电路(3D-IC)是克服互连规模障碍的一项重要新技术。它具有显著的优势，包括更高的功能密度、更高的性能和更低的功耗。这项研究项目将探索3D-IC测试和修复的新想法、概念和方向，有望显著降低测试成本和提高成品率。能够选择哪些芯片/晶片堆叠在一起，以及在构建3D-IC时以什么顺序和旋转对称的自由度可以利用。将研究使用这种技术来降低成本并提高缺陷容错技术的有效性的新策略。为了降低测试成本，将开发新的分布式测试压缩架构，它将创建一种新的测试调度范例，使测试调度具有更大的灵活性和效率，以缩短测试时间和提高产品质量。这一研究项目将产生新的理论、概念和技术，显著提高3D-IC的测试成本和成品率。这是压低3D芯片制造成本、让它们打入新市场、造福社会的关键因素。从这个项目产生的知识和经验将被纳入到VLSI设计和测试课程中。学生将接受培训，为下一代半导体劳动力做好准备。本科生将参与这个项目，包括那些来自代表不足的群体的学生，通过基于这项研究的本科生研究项目、高级设计项目和课程项目。

Three-dimensional integrated circuits (3D-ICs) using through-silicon vias (TSVs) is an important new technology that overcomes barriers in interconnect scaling. It provides significant advantages including increased functional density, higher performance, and lower power. This research project will explore new ideas, concepts, and directions for test and repair of 3D-ICs which hold promise to significantly reduce test costs and improve yield. The ability to select which dies/wafers are stacked together and in what order and with what rotational symmetry are degrees of freedom in constructing 3D-ICs that can be exploited. New strategies for using this to reduce the cost and increase the effectiveness of defect tolerance techniques will be investigated. To reduce test costs, new distributed test compression architectures will be developed which create a new paradigm for test scheduling enabling much greater flexibility and efficiency to shorten test time and improve product quality. This research project will generate new theory, concepts, and techniques for significantly improving test costs and yield for 3D-ICs. This is a key factor for keeping down the manufacturing costs of 3D chips and allowing them to penetrate new markets and benefit society. Knowledge and experience generated from this project will be incorporated into courses in VLSI design and test. Students will be trained and prepared for the next generation semiconductor workforce. Undergraduate students will be involved in the project, including those from underrepresented groups, through undergraduate research projects, senior design projects, and course projects based on this research.