SHF:Small: Next Generation Test Compression Technology

SHF:Small：下一代测试压缩技术

• 批准号: 0916837
• 负责人: Nur Touba
• 金额: $ 35.5万
• 依托单位: University of Texas at Austin
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2009
• 资助国家: 美国
• 起止时间: 2009-09-01 至 2013-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0916837&HistoricalAwards=false
• 关键词: SHF; Small; Next; Generation; Test

PROPOSAL NO: 0916837 INSTITUTION: University of Texas at Austin PRINCIPAL INVESTIGATOR: Touba, NurTITLE: Next Generation Test Compression TechnologyAbstract Testing integrated circuits (ICs) requires storing large amounts of test data on a tester and transferring it to/from the chip-under-test. The bandwidth between the tester and chip is very limited due to limited pins and tester channels. Test data volume continues to grow dramatically with increasingly dense system-on-chips (SOCs) and three-dimensional ICs as well as the need for additional tests to target defects in nanometer designs. A major development in the field over the past decade has been the emergence of test compression technology which stores test data on the tester in compressed form and decompresses it on-chip. The commercialization of this technology has helped immensely in keeping up with rising test data volume. However, going forward, there is a need for a next generation of test compression technology that can provide significantly greater compression to handle the larger designs of the future. This research will develop new theory, concepts, and architectures that are fundamentally different from existing commercial technology and have the potential for providing an order of magnitude or more improvement for test stimulus compression as well as output response compaction. Society increasingly relies on correct and dependable operation of electronic devices. The impact of this research will be to develop new technology to keep test costs down and make it economical to fit in more tests to improve product quality. This will be critical as the manufacturing process becomes increasingly difficult to control at smaller geometries. Participation of undergraduates, women, and minorities will be actively encouraged.

提案编号：0916837机构：德克萨斯大学奥斯汀分校校长：Touba，NurTitle：下一代测试压缩技术摘要测试集成电路（IC）需要在测试仪上存储大量测试数据，并将其传输到被测芯片/从被测芯片传输。 由于引脚和测试仪通道有限，测试仪和芯片之间的带宽非常有限。 测试数据量持续急剧增长，芯片上系统（SOC）和三维集成电路的密度越来越大，以及需要额外的测试，以针对纳米设计中的缺陷。 在过去的十年中，该领域的一个主要发展是测试压缩技术的出现，该技术将测试数据以压缩形式存储在测试仪上，并在芯片上对其进行解压缩。 这项技术的商业化极大地帮助跟上不断增长的测试数据量。 然而，展望未来，需要下一代测试压缩技术，该技术可以提供更大的压缩以处理未来更大的设计。 这项研究将开发新的理论，概念和架构，从根本上不同于现有的商业技术，并有可能提供一个数量级或更多的改进测试刺激压缩以及输出响应压缩。社会越来越依赖于电子设备的正确和可靠的操作。 这项研究的影响将是开发新技术，以降低测试成本，并使其经济适用于更多的测试，以提高产品质量。 这将是至关重要的，因为制造过程变得越来越难以控制在较小的几何形状。 将积极鼓励大学生、妇女和少数民族的参与。