AIR Option 2: Research Alliance - Development of key technology for next generation projection lithography of integrated circuits at 6.X nm wavelength

AIR选项2：研究联盟——开发下一代6.X nm波长集成电路投影光刻关键技术

• 批准号: 1343456
• 负责人: Jorge Rocca
• 金额: $ 40万
• 依托单位: Colorado State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-10-01 至 2016-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1343456&HistoricalAwards=false
• 关键词: AIR; Option; Research; Alliance; Development

This PFI: AIR Research Alliance project focuses on the translation and transfer of extreme ultraviolet (EUV) source technologies at 6.Xnm wavelength to fill technology gaps in advanced lithography for future generations of integrated circuits. These technologies serve the semiconductor industry, with a world market valued of $298 Billion, that manufactures the semiconductor chips used in virtually all industrial, automotive, telecommunications, computing, military, medical, and consumer products. The next-generation 6.X nm wavelength lithography will extend Moore?s law and the growth of the semiconductor industry into the next decade. This project will address both the development of plasma-based light sources at 6.X nm to print integrated circuits, as well as the development of compact light sources to address challenges associated with nano-metrology. This project will also accelerate technology transfer by enabling the realization of new light sources to print and characterize integrated circuit features of smaller dimension, resulting in the creation of new jobs in the semiconductor and laser industry, and in high value semiconductor manufacturing equipment products. The partnership engaged to accelerate the transfer of the technologies to the market domain includes the NSF Center for Extreme Ultraviolet Science and Technology, the University of California at San Diego with extensive expertise in EUV technology, and Cymer Inc., a leader in light sources for lithography, that plans to commercialize the 6.X nm wavelength integrated circuit printing technology. The potential economic impact of extending lithography to smaller dimensions is enormous. The semiconductor industry is a key driver of the U.S. economy. The lithography process is the single most critical and capital intensive part of the semiconductor manufacturing process and as such will significantly contribute to the U.S. competitiveness in the semiconductor equipment market. Lithographic processing and metrology equipment accounts for ~50% of capital equipment cost in U.S. and foreign semiconductor facilities. The societal impact includes jobs in the high technology sector and contributions to an increased standard of living and lifespan world-wide. The proposed academic/industry ecosystem will also allow for the creation of a unique environment to educate and train the workforce necessary to maintain the US competitiveness in this area critical to the nation?s economy.

该PFI：空气研究联盟项目的重点是在6.xnm波长下的极端紫外线（EUV）源技术的翻译和转移，以填补对后代集成电路的高级光刻缩影的技术空白。这些技术为半导体行业提供服务，其价值为2980亿美元的世界市场生产了几乎所有工业，汽车，电信，计算，军事，军事，医疗和消费产品的半导体芯片。下一代6.x nm波长光刻将把摩尔的定律和半导体行业的增长扩展到未来十年。该项目将解决基于等离子体的光源在6.x nm上的开发，以打印集成电路，也可以开发紧凑的光源，以应对与纳米成绩相关的挑战。该项目还将通过实现新的光源来打印和表征较小尺寸的集成电路特征，从而加速技术转移，从而在半导体和激光行业中创建新的工作，以及高价值半导体制造设备产品。涉及加速技术向市场领域的合作伙伴关系包括NSF极端紫外线科学技术中心，加利福尼亚大学圣地亚哥分校，在EUV技术方面具有广泛的专业知识，以及光刻的光源领导者Cymer Inc.计划将6.x NM WavelEmpt Ectibal Integrated Election Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated Integrated。将光刻扩展到较小维度的潜在经济影响是巨大的。半导体行业是美国经济的主要驱动力。光刻过程是半导体制造过程中最关键和最重要的部分，因此将极大地促进美国在半导体设备市场中的竞争力。光刻处理和计量设备占美国和外国半导体设施中资本设备成本的约50％。社会影响包括高科技领域的工作以及对全球生活和寿命提高的贡献。拟议的学术/工业生态系统还将允许创造一个独特的环境，以教育和培训必要的劳动力，以维持美国在该领域的竞争力对国家的经济至关重要。