SHF: Small: Leveraging Monolithic 3D for Architectural Innovations
SHF: Small: Leveraging Monolithic 3D for Architectural Innovations
批准号:
2008365
负责人:
VIJAYKRISHNAN NARAYANAN
金额:
$50.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2020
资助国家:
美国
项目状态:
已结题
起止时间:
2020-06-15 至 2024-05-31
中文摘要
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英文摘要
The design of more efficient processors is a major driving force of the computing industry. Over multiple decades, reducing the size of transistors, which are the building blocks of microprocessors, has been the main driver for efficiency improvements. With this trend of transistor shrinking nearing the physical limit, this research explores three-dimensional chips, where transistors are stacked in multiple layers, as an alternate approach to enhance efficiency. A major challenge with three-dimensional chips is the large dimension of the connections compared to the transistor itself. This project will leverage a new technology called monolithic three-dimensional design (M3D), where inter-layer connections are of dimensions similar to that of a transistor. This research will result in new M3D-based designs for microprocessors that reduce energy and time consumed in interconnections, and enable new functional features for microprocessors. The project will also enhance the national workforce development efforts by training undergraduate, graduate and underrepresented groups in a much-needed area of semiconductor electronics. This project will involve synergistic exploration of process technology and M3D-based architectural design spaces of processors towards achieving transformational impact on processor and accelerator performance. The research will first develop a simulation infrastructure that enables systematic exploration of the space by varying the architectural and technology parameters. Leveraging the simulation infrastructure, this project will perform the following tasks: (1) evaluation of layer-wise partitioning of processor core and cache structures; (2) design of primitive compute functions for integration with the cache memories; (3) design of M3D-enabled application-specific accelerators; and (4) integration of heterogeneous memory technologies to provide support for power efficiency.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
期刊论文(11)
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Compact Ferroelectric Programmable Majority Gate for Compute-in-Memory Applications
适用于内存计算应用的紧凑型铁电可编程多数门
DOI:
10.1109/iedm45625.2022.10019400
发表时间:
2022
期刊:
2022 International Electron Devices Meeting (IEDM
影响因子:
--
作者:
[Deng, Shan, Benkhelifa, Mahdi, Thomann, Simon, Faris, Zubair, Zhao, Zijian, Huang, Tzu-Jung, Xu, Yixin, Narayanan, Vijaykrishnan, Ni, Kai, Amrouch, Hussam]
通讯作者:
Amrouch, Hussam
CAPE: A Content-Addressable Processing Engine
CAPE:内容可寻址处理引擎
DOI:
10.1109/hpca51647.2021.00054
发表时间:
2021
期刊:
IEEE Int'l Symp. on High-Performance Computer Architecture (HPCA
影响因子:
--
作者:
[Caminal, Helena, Yang, Kailin, Srinivasa, Srivatsa, Ramanathan, Akshay Krishna, Al-Hawaj, Khalid, Wu, Tianshu, Narayanan, Vijaykrishnan, Batten, Christopher, Martinez, Jose F.]
通讯作者:
Martinez, Jose F.
DOI:
10.1109/iscas48785.2022.9937438
发表时间:
2022-05
期刊:
2022 IEEE International Symposium on Circuits and Systems (ISCAS)
影响因子:
--
作者:
[Jianfeng Wang;Nuo Xiu;Juejian Wu;Yiming Chen;Yanan Sun;Huazhong Yang;N. Vijaykrishnan;Sumitha George;Xueqing Li]
通讯作者:
Jianfeng Wang;Nuo Xiu;Juejian Wu;Yiming Chen;Yanan Sun;Huazhong Yang;N. Vijaykrishnan;Sumitha George;Xueqing Li
DOI:
10.1109/tcsi.2023.3251961
发表时间:
2023-06
期刊:
IEEE Transactions on Circuits and Systems I: Regular Papers
影响因子:
--
作者:
[Wenjun Tang;Ming-En Lee;Juejian Wu;Yixin Xu;Yao Yu;Yongpan Liu;Kai Ni;Yu Wang;Huazhong Yang;V. Narayanan;Xueqing Li]
通讯作者:
Wenjun Tang;Ming-En Lee;Juejian Wu;Yixin Xu;Yao Yu;Yongpan Liu;Kai Ni;Yu Wang;Huazhong Yang;V. Narayanan;Xueqing Li
DOI:
10.1145/3453688.3461745
发表时间:
2021
期刊:
GLSVLSI '21: Proceedings of the 2021 on Great Lakes Symposium on VLSI
影响因子:
--
作者:
[Bashar, Mohammad Khairul, Vaidya, Jaykumar, Surya Kanthi, R. S., Lee, Chonghan, Shi, Feng, Narayanan, Vijaykrishnan, Shukla, Nikhil]
通讯作者:
Shukla, Nikhil
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