Integrated Microactuator Systems Emphasizing Ni-Mn-Ga Films with a Tailored Microstructure - INTACT - Micromachining and Integration of Ni-Mn-ga Film Actuators for Microsystems Applications

该子项目是一个联合项目的一部分，该项目旨在开发基于高达10%的大应变磁形状记忆（MSM）合金的新型集成微执行器系统。主要目标是建立和验证一个封闭的工艺链，以实现在微系统环境中具有块体固有特性的溅射Ni-Mn-Ga薄膜。子课题首先重点研究了获得可自由移动MSM微结构的关键技术。其中包括溅射MSM薄膜的微加工和功能化，这需要与生产具有小阻塞应力的高取向薄膜的技术相兼容。为了满足各种限制条件，需要在优化的缓冲液/衬底上进行单独的工艺和相应的转移技术。进一步开发的技术包括FSMA微结构的混合集成，包括平面内和垂直于基板平面的电接触。系统实验将在测试结构和微致动器上进行面外操作来验证这些技术。

This sub-project is part of a joint project, which intents to develop novel integrated microactuator systems based on the large strains of magnetic shape memory (MSM) alloys of up to 10 %. The main objective is to establish and validate a closed process chain to implement sputtered Ni-Mn-Ga films with bulk-like intrinsic properties in a microsystem environment. The sub-project first concentrates on the key technologies to obtain freely movable MSM microstructures. These include the micromachining and functionalizing of sputtered MSM films, which need to be compatible with the technologies to produce highly oriented films with small blocking stress. In order to meet the various constraints, individual processes on optimized buffers/substrates and corresponding transfer technologies will be required. Further technologies to be developed comprise the hybrid integration of FSMA microstructures including the electrical contacting within the plane and perpendicular to the plane of substrate. Systematic experiments will be performed on test structures and microactuators with out-of-plane operation to validate the technologies.