Integrated Microactuator Systems Emphasizing Ni-Mn-Ga Films with a Tailored Microstructure - INTACT - Micromachining and Integration of Ni-Mn-ga Film Actuators for Microsystems Applications

该子项目是一个联合项目的一部分，该项目旨在开发基于高达10%的磁性形状记忆（MSM）合金的大应变的新型集成微致动器系统。主要目的是建立和验证一个封闭的工艺链，以实现溅射Ni-Mn-Ga薄膜的块状本征特性在微系统环境。该子项目首先集中在获得自由移动MSM微结构的关键技术。这些包括溅射MSM膜的微加工和功能化，这需要与生产具有小阻挡应力的高度取向的膜的技术兼容。为了满足各种限制，将需要优化缓冲液/底物的单独工艺和相应的转移技术。待开发的进一步技术包括FSMA微结构的混合集成，包括平面内和垂直于基板平面的电接触。将在测试结构和具有面外操作的微致动器上进行系统的实验，以验证这些技术。

This sub-project is part of a joint project, which intents to develop novel integrated microactuator systems based on the large strains of magnetic shape memory (MSM) alloys of up to 10 %. The main objective is to establish and validate a closed process chain to implement sputtered Ni-Mn-Ga films with bulk-like intrinsic properties in a microsystem environment. The sub-project first concentrates on the key technologies to obtain freely movable MSM microstructures. These include the micromachining and functionalizing of sputtered MSM films, which need to be compatible with the technologies to produce highly oriented films with small blocking stress. In order to meet the various constraints, individual processes on optimized buffers/substrates and corresponding transfer technologies will be required. Further technologies to be developed comprise the hybrid integration of FSMA microstructures including the electrical contacting within the plane and perpendicular to the plane of substrate. Systematic experiments will be performed on test structures and microactuators with out-of-plane operation to validate the technologies.