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RF MEMS device based on micromachining

基于微机械加工的射频MEMS器件

基本信息

批准号：
16201027
负责人：
ESASHI Masayoshi
金额：
$ 31.2万
依托单位：
Tohoku University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (A)
财政年份：
2004
资助国家：
日本
起止时间：
2004 至 2006
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-16201027/
关键词：
Micromachining Micromachine Wireless MEMS Sensor Actuator Relay Resonator マイクロマシニング

项目摘要

Three-dimensional microstructures, sensors and actuators can be fabricated on a silicon chip using micromachining which is an extended technology based microfabrication for integrated circuits. RF MEMS (Radio Frequency Micro Electro Mechanical Systems) has been developed to produce RF components for wireless systems. Switches (relays), variable capacitors, micromechanical resonators for time (frequency) references or RF filters, RF interconnection and coils which are fabricated on thin self supported membranes and hence have small stray capacitances can be made by this technology. Following achievements are obtained in this research program.Packaging technologies for the RF MEMS as wafer level packaging processes and electrical feedthrough structures for an electrical interconnection for high speed signal from the top side to the backside of silicon chips were developed. MEMS switches as contact type and capacitive type which are actuated electrostatically were developed.MEMS switches … More were applied for a flexible flat panel display and commercialized as components for high speed LSI testers.Micromechanical resonators can have high resonant frequencies. The extension mode enables higher resonant frequency than the bending mode because of the high spring constant of the extension mode. By making the resonant frequency determined by the lateral dimension multiple resonators with different resonant frequencies can be integrated on a chip. An electrostatically driven wine glass mode silicon disk resonator of witch diameter is 20 μm demonstrated a resonant frequencies of approximately 100 MHz. Since the resonant frequency of such small resonators can be fluctuated by absorbing gas MEMS resonator was fabricated in a vacuum cavity in a silicon chip to stabilize the resonant frequency. Micromechanical resonators have an inherent problem of phase noise caused by thermomechanical noise.The thermomechanical noise also limit the resolution of resonating sensors. Extreme sensitivity is required for MRFM (Magnetic Resonance Force Microscopy) for the MRI (Magnetic Resonance Microscopy) of small samples as biological cell. The noise problems were studied and the phase noise could be reduced by a parametric squeeze damping. Cantilever resonant sensors which have high quality factor in atmosphere were.developed by using quartz material with thickness share mode.High aspect ratio planer coils.were fabricated to reduce the resistance.and high quality factor as high as 85 at 1.6 GHz was achieved for the purpose of the MRI for the small samples. Less

三维微结构、传感器和致动器可以使用微机械加工在硅芯片上制造，微机械加工是用于集成电路的基于微制造的扩展技术。RF MEMS（射频微机电系统）已经被开发用于生产用于无线系统的RF元件。开关（继电器）、可变电容器、用于时间（频率）基准的微机械谐振器或RF滤波器、RF互连和线圈（其制造在薄的自支撑膜上并且因此具有小的杂散电容）可以通过该技术来制造。本研究取得了以下成果：开发了用于RF MEMS的圆片级封装工艺和用于高速信号从硅片顶面到背面的电互连的电馈通结构。静电驱动的MEMS开关有接触式和电容式两种。 ...更多信息微机械谐振器可以具有高的谐振频率。由于伸展模式的高弹簧常数，伸展模式能够实现比弯曲模式更高的谐振频率。通过使谐振频率由横向尺寸确定，可以在芯片上集成具有不同谐振频率的多个谐振器。用静电驱动的直径为20 μm的酒杯模硅圆片谐振器，其谐振频率约为100MHz。由于这种小型谐振器的谐振频率会因吸收气体而发生波动，因此将MEMS谐振器制作在硅芯片的真空腔中以稳定谐振频率。微机械谐振器存在由热机械噪声引起的相位噪声问题，热机械噪声也限制了谐振传感器的分辨率。MRFM（磁共振力显微镜）用于小样本（如生物细胞）的MRI（磁共振显微镜）需要极高的灵敏度。研究了相位噪声问题，提出了一种参数挤压阻尼方法来降低相位噪声。利用厚度共享模式的石英材料研制了在大气中具有高品质因数的悬臂梁谐振传感器，并制作了高深宽比的平面线圈以降低电阻，在1.6GHz时获得了高达85的高品质因数，以满足小样品的磁共振成像要求。少