Sputtering System for Thin Films in Microsystems

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Besides evaporation, sputtering is the most commonly used PVD (Physical Vapour Deposition) process for thin film deposition in microsystems technology. It is characterized by high deposition rates of thin films with low roughness, high density and lateral homogeneity as well as good adhesion to almost any substrate. In addition, a wide variety of conductive as well as non-conductive materials can be deposited using this process. Thus, this manufacturing process is fundamental and indispensable for the fabrication of three-dimensional micro components and systems. The existing sputtering system of the IMT, a laboratory system, was procured in 1995 and in essential aspects no longer corresponds to the current state of the art. Due to the outdated and error-prone hardware and software, the system no longer meets the high requirements regarding layer thickness and homogeneity. The reproducibility of the processes is also no longer guaranteed. As a result, some thin-film materials can now only be deposited with reduced quality and others not at all. Important spare parts are also no longer available. The expected breakdown of the plant will result in a long-term interruption of ongoing research projects and even their termination. The thin-film process can only be brought up to an innovative technological level with a new, modern sputtering system. It is designed to maximize the selection of thin film materials and their properties and to ensure the quality and reproducibility of the processes. Simultaneous loading of multiple substrates will allow for time savings and, consequently, cost reductions. The presence of multiple sputtering sources should allow different materials to be made available at the same time and without conversion. Switching to other processes will thus be easier and faster. Furthermore, the so-called co-sputtering shall enable new deposition processes and materials with different layer properties. The High Power Impulse Magnetron Sputtering (HiPIMS) technology will also expand the research potential with regard to thin film process development. The proposed sputtering system will enable more in-depth investigations and significantly more variations in deposition processes/materials and layer properties with higher quality process assurance. This suggests that entirely new approaches to existing research questions can be developed and innovative ideas and research concepts for coatings and systems can be developed. The IMT would have the opportunity to distinguish itself even more clearly from research institutions with a similar technological orientation. Industrial users can then also benefit from the transfer of research results.