Sputtering System for Thin Films in Microsystems

微系统中的薄膜溅射系统

• 批准号: 501131927
• 金额: --
• 依托单位: Technische Universität Braunschweig
• 依托单位国家: 德国
• 项目类别: Major Research Instrumentation
• 财政年份: 2022
• 资助国家: 德国
• 起止时间: 2021-12-31 至 无数据
• 项目状态: 未结题
• 来源: https://gepris.dfg.de/gepris/projekt/501131927?language=en
• 关键词: Sputtering; System; Thin; Films; Microsystems

Besides evaporation, sputtering is the most commonly used PVD (Physical Vapour Deposition) process for thin film deposition in microsystems technology. It is characterized by high deposition rates of thin films with low roughness, high density and lateral homogeneity as well as good adhesion to almost any substrate. In addition, a wide variety of conductive as well as non-conductive materials can be deposited using this process. Thus, this manufacturing process is fundamental and indispensable for the fabrication of three-dimensional micro components and systems. The existing sputtering system of the IMT, a laboratory system, was procured in 1995 and in essential aspects no longer corresponds to the current state of the art. Due to the outdated and error-prone hardware and software, the system no longer meets the high requirements regarding layer thickness and homogeneity. The reproducibility of the processes is also no longer guaranteed. As a result, some thin-film materials can now only be deposited with reduced quality and others not at all. Important spare parts are also no longer available. The expected breakdown of the plant will result in a long-term interruption of ongoing research projects and even their termination. The thin-film process can only be brought up to an innovative technological level with a new, modern sputtering system. It is designed to maximize the selection of thin film materials and their properties and to ensure the quality and reproducibility of the processes. Simultaneous loading of multiple substrates will allow for time savings and, consequently, cost reductions. The presence of multiple sputtering sources should allow different materials to be made available at the same time and without conversion. Switching to other processes will thus be easier and faster. Furthermore, the so-called co-sputtering shall enable new deposition processes and materials with different layer properties. The High Power Impulse Magnetron Sputtering (HiPIMS) technology will also expand the research potential with regard to thin film process development. The proposed sputtering system will enable more in-depth investigations and significantly more variations in deposition processes/materials and layer properties with higher quality process assurance. This suggests that entirely new approaches to existing research questions can be developed and innovative ideas and research concepts for coatings and systems can be developed. The IMT would have the opportunity to distinguish itself even more clearly from research institutions with a similar technological orientation. Industrial users can then also benefit from the transfer of research results.

除了蒸发，溅射是微系统技术中最常用的PVD（物理气相沉积）薄膜沉积工艺。它的特点是具有低粗糙度，高密度和横向均匀性以及良好的附着力，几乎任何基板的薄膜沉积速率高。此外，可以使用该工艺沉积各种各样的导电材料以及非导电材料。因此，这种制造工艺对于三维微部件和系统的制造是基本的和不可缺少的。IMT现有的溅射系统是一个实验室系统，是在1995年采购的，在基本方面不再符合当前的技术水平。由于硬件和软件过时且容易出错，该系统不再满足关于层厚度和均匀性的高要求。工艺的再现性也不再得到保证。因此，一些薄膜材料现在只能以降低的质量沉积，而另一些则根本不能沉积。重要的备件也不再可用。该工厂的预期故障将导致正在进行的研究项目长期中断，甚至终止。只有采用新型现代溅射系统，薄膜工艺才能达到创新的技术水平。它旨在最大限度地选择薄膜材料及其特性，并确保工艺的质量和再现性。同时装载多个基板将允许节省时间，并因此降低成本。多个溅射源的存在应允许同时提供不同的材料，而无需转换。因此，转换到其他进程将更容易和更快。此外，所谓的共溅射将实现具有不同层性质的新沉积工艺和材料。高功率脉冲磁控溅射（HiPIMS）技术也将扩大薄膜工艺开发方面的研究潜力。所提出的溅射系统将能够进行更深入的研究，并在沉积工艺/材料和层特性方面有更多的变化，同时具有更高的质量工艺保证。这表明可以开发针对现有研究问题的全新方法，并可以开发涂料和系统的创新想法和研究概念。IMT将有机会更清楚地将自己与具有类似技术方向的研究机构区分开来。工业用户也可以从研究成果的转让中受益。