Standard NbN and NbTiN films prepared by nitrogen implantation for process characterization and optimization

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This six month project aims to achieve standard NbN and NbTiN thin films of 100-200 nm thickness onsapphire substrates using nitrogen ion implantation, and compare their physical properties to similar filmsprepared by sputter deposition for quality control and process optimization. These features address a problemof critical importance for Angstrom Engineering Inc., our industrial partner, who develops advanced depositionsystems and implements fabrication processes for basic and applied research, related to sensing technology,superconductive electronic devices and nanomaterials engineering. The company will provide pure depositedNb and NbTi films that will be implanted by N+ ion and annealed at INRS, as well as NbN and NbTiNsamples synthesized under different deposition parameters using Angstrom's commercial instruments. Theenergy and dose of implanted nitrogen ions will be set to enable a relevant comparison between the differentsamples, using Monte-Carlo simulations supported by advanced characterization tools, such as SE, SEM, EDX,Raman, and XRD analyses. Both NbN and NbTiN films prepared by sputter deposition and processed by ionimplantation will be then investigated at low-temperatures, to measurement their electrical resistivity andcritical temperatures. Our research will be mainly conducted in the Montréal Area, where facilities for ionimplantation and advanced characterization are available. To achieve our objectives, which include theprocessing of several ion-implanted prototypes to be used as reference specimens by the company and extendboth the know-how and the expertise of Angstrom's scientific staff, Prof. Rosei will be assisted by a researchassociate during the whole duration of the project. The expected impact will result in advancing knowledge onNb-based superconductive films and their synthesis, for future work in the areas of non-destructive metrology,advanced manufacturing and materials engineering.