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ML-Based Techniques for Physical Design Automation of SoCs

ML-Based Techniques for Physical Design Automation of SoCs
基于 ML 的 SoC 物理设计自动化技术
批准号:
556429-2020
负责人:
Ivanov, Andre
金额:
$2.19万
依托单位国家:
加拿大
项目类别:
Alliance Grants
财政年份:
2020
资助国家:
加拿大
项目状态:
已结题
起止时间:
2020-01-01 至 2021-12-31

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中文摘要
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英文摘要
Semiconductors and the integrated circuits (ICs) made from them are ubiquitous and continue to penetrate all sectors of our economies, all built and natural environments, the globe, and outer space. ICs built with state of the art manufacturing technologies contain billions of electronic devices (transistors) interconnected together through myriads of intricate and complex layers and strips (wires) of conducting and non-conducting materials. Completing the design and verifying the correctness of such an interconnection network presents formidable challenges. These challenges are partly overcome through the aid of sophisticated computer-aided design (CAD) or electronic design automation (EDA) tools. These tools, in turn, amount to massive, highly complex software packages used by teams of integrated circuit designers worldwide. The level of complexity of the integrated circuits of today and those envisioned in the near and longer term is such that the EDA tools, while able to provide invaluable aid, tend to be very slow to yield viable solutions as the computational complexity of the problem at hand tends to be extremely large. This research is focused on developing novel methodologies aimed at significantly accelerating the phases of integrated circuit design commonly referred to as physical IC design and more specifically as "place and route". We propose to develop a new framework that draws on artificial intelligence, and, in particular, machine learning techniques, to accelerate and improve the quality of place and route EDA tools. The improvements and acceleration we aim for will allow IC designers' efforts to converge on better designs faster. Overall, this paves the way to the production of higher performance ICs in lesser time and at reduced cost. Many Canadian and multi-national companies and organizations are in the business of developing ICs for applications in various sectors. Our research outcomes would directly benefit such companies. Many other organizations, Canadian and multi-national operating in Canada, have their businesses directly or indirectly dependent on ICs. These organizations will also benefit, albeit indirectly, from the results of the work proposed here.
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Aging and Reliability Effects Modelling and Mitigation in Nanoelectronics and Sensors
  • 批准号:
    RGPIN-2019-04016
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.04万
  • 财政年份:
    2022
  • 负责人:
    Ivanov, Andre
  • 依托单位:
Reliability-Aware Design of Systems on Chip (SoCs)
  • 批准号:
    555744-2020
  • 项目类别:
    Alliance Grants
  • 资助金额:
    $7.18万
  • 财政年份:
    2021
  • 负责人:
    Ivanov, Andre
  • 依托单位:
ML-Based Techniques for Physical Design Automation of SoCs
  • 批准号:
    556429-2020
  • 项目类别:
    Alliance Grants
  • 资助金额:
    $2.19万
  • 财政年份:
    2021
  • 负责人:
    Ivanov, Andre
  • 依托单位:
Aging and Reliability Effects Modelling and Mitigation in Nanoelectronics and Sensors
  • 批准号:
    RGPIN-2019-04016
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.04万
  • 财政年份:
    2021
  • 负责人:
    Ivanov, Andre
  • 依托单位:
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