ML-Based Techniques for Physical Design Automation of SoCs

基于 ML 的 SoC 物理设计自动化技术

• 批准号: 556429-2020
• 负责人: Ivanov, Andre
• 金额: $ 2.19万
• 依托单位: University of British Columbia
• 依托单位国家: 加拿大
• 项目类别: Alliance Grants
• 财政年份: 2021
• 资助国家: 加拿大
• 起止时间: 2021-01-01 至 2022-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=722796
• 关键词: ML; Based; Techniques; Physical; Design

Semiconductors and the integrated circuits (ICs) made from them are ubiquitous and continue to penetrate all sectors of our economies, all built and natural environments, the globe, and outer space. ICs built with state of the art manufacturing technologies contain billions of electronic devices (transistors) interconnected together through myriads of intricate and complex layers and strips (wires) of conducting and non-conducting materials. Completing the design and verifying the correctness of such an interconnection network presents formidable challenges. These challenges are partly overcome through the aid of sophisticated computer-aided design (CAD) or electronic design automation (EDA) tools. These tools, in turn, amount to massive, highly complex software packages used by teams of integrated circuit designers worldwide. The level of complexity of the integrated circuits of today and those envisioned in the near and longer term is such that the EDA tools, while able to provide invaluable aid, tend to be very slow to yield viable solutions as the computational complexity of the problem at hand tends to be extremely large. This research is focused on developing novel methodologies aimed at significantly accelerating the phases of integrated circuit design commonly referred to as physical IC design and more specifically as "place and route". We propose to develop a new framework that draws on artificial intelligence, and, in particular, machine learning techniques, to accelerate and improve the quality of place and route EDA tools. The improvements and acceleration we aim for will allow IC designers' efforts to converge on better designs faster. Overall, this paves the way to the production of higher performance ICs in lesser time and at reduced cost. Many Canadian and multi-national companies and organizations are in the business of developing ICs for applications in various sectors. Our research outcomes would directly benefit such companies. Many other organizations, Canadian and multi-national operating in Canada, have their businesses directly or indirectly dependent on ICs. These organizations will also benefit, albeit indirectly, from the results of the work proposed here.

半导体和由它们制成的集成电路（ic）无处不在，并将继续渗透到我们经济的所有部门、所有人造环境和自然环境、地球和外层空间。采用最先进制造技术制造的集成电路包含数十亿个电子设备（晶体管），通过无数错综复杂的导电和非导电材料层和带（线）连接在一起。完成这种互联网络的设计并验证其正确性是一项艰巨的挑战。这些挑战在一定程度上可以通过复杂的计算机辅助设计（CAD）或电子设计自动化（EDA）工具来克服。这些工具，反过来，相当于庞大的，高度复杂的软件包，由世界各地的集成电路设计团队使用。今天集成电路的复杂程度以及近期和长期的设想是这样的，EDA工具虽然能够提供宝贵的帮助，但由于手头问题的计算复杂性往往非常大，因此产生可行的解决方案往往非常缓慢。这项研究的重点是开发新的方法，旨在显著加快集成电路设计的各个阶段，通常被称为物理IC设计，更具体地说是“位置和路由”。我们建议开发一个新的框架，利用人工智能，特别是机器学习技术，来加速和提高位置和路线EDA工具的质量。我们的目标是改进和加速将使IC设计师的努力更快地集中在更好的设计上。总的来说，这为以更短的时间和更低的成本生产更高性能的集成电路铺平了道路。许多加拿大和跨国公司和组织都在为各个领域的应用开发集成电路。我们的研究成果将直接惠及这些公司。许多其他组织，加拿大和在加拿大经营的跨国公司，其业务直接或间接依赖于ic。这些组织也将间接地从这里提出的工作成果中受益。