Analysis and Design of Interconnects for Microelectronics Applications (Minority Research Initiation)

高速器件制造的进步和对数字电路中更高水平的集成的日益增长的需求导致了网络和计算机的设计以及它们的互连的几个重要变化，包括片上和片外。目前，随着上升时间的加快，所涉及的延迟更短、频率更高，需要对网络进行简单的分析和直接的模拟，不再可能使用旧的工具。必须开发更复杂、更复杂的模型和分析工具来模拟网络组件之间的互连电路。在互连的设计和模拟中，计算机辅助设计(CAD)工具在帮助这种分析方面起着至关重要的作用。测量技术在决定设计方法的准确性以及所考虑的设计的可行性方面发挥着积极的作用。实验室模拟允许与计算机模拟进行比较，并验证模拟技术的准确性。最后，必须设计和分析新的互连方案，以取代旧的方法。这项研究的目的是为了更好地了解微电子封装和高速数字网络应用中互连的行为和性能。在研究中可以区分三个重要方面：1)建立准确的模型和分析信号在互连中的传播：2)互连的实验表征；3)实现了基于互连的计算机辅助设计仿真程序。

Progress made in the fabrication of high-speed devices and the increasing demand for a higher level of integration in digital circuits have led to several important changes in the design of networks and computers, and in their interconnections, both on-chip and off. At present, with the faster rise times, shorter delays and higher frequencies involved simple analysis and straightforward simulation of the networks are involved and no longer possible using the old tools. It is essential to develop more complex and more sophisticated models and analysis tools for simulating the interconnecting circuits between components of the network. Computer-aided design (CAD) tools play an essential role in helping this analysis, in both the design and the simulation of the interconnects. Measurement techniques play an active role in determining the accuracy of the design methods as well as the feasibility of the design considered. Laboratory simulations allow a comparison with computer simulations and verification of the accuracy of the simulation techniques. Finally, new interconnect schemes must be devised and analyzed to replace older methodologies. The object of the proposed research is to provide a better understanding of the behavior and performance of interconnections in microelectronics packaging and high-speed digital network applications. Three important aspects can be distinguished in the study: 1) development of accurate models and analysis of signal propagation in interconnects; 2) experimental characterization of interconnections; and 3) implementation of an interconnect-based computer-aided design simulation program.