Ultra-precise high-speed milling

采用超精密高速铣削技术，可以将单晶金刚石刀具光栅铣削非旋转对称光学表面的加工时间缩短10倍。在第一个资助期研究了金属基体的高速铣削，第二个资助期致力于脆性材料的韧性加工，特别是单晶锗、硅、硒化锌和硫化锌等红外材料的高速金刚石铣削。该项目的目的是验证在韧性材料去除模式下，随着切割速度的增加，临界切割深度的增加和向绝热剪切的过渡，从而减少金属基板的刀具金刚石磨损。最后，将两个资助期建立的技术基础应用于利用超精密电磁轴承共同实验平台实现高速光栅铣削和螺旋铣削，包括课题组其他研究项目开发的组件和方法。

The exceedingly long processing times involved in raster milling of non-rotationally symmetric optical surfaces with single crystal diamond tools can be cut down by a factor of 10 by applying ultra-precision high-speed milling. While in the first funding period high-speed milling of metal substrates has been investigated, the second funding period is devoted to the ductile machining of brittle materials, in particular the high-speed diamond milling of IR-materials like singe crystal germanium, silicon, zinc selenide and zinc sulfide. The aim of the project is the verification of an increase of the critical depth of cut and a transition to adiabatic shearing with increasing cutting speed in the ductile material removal mode leading to a reduction of tool diamond wear as in the case of metal substrates. Finally, the technological basis established in both funding periods shall be applied for realizing high-speed raster milling and spiral milling including the components and methods developed within the other research projects of the research group using the common experimental platform with ultraprecise electromagnetic bearings.