PFI-TT: Thermal Management of Power Semiconductor Electronics

这项创新技术转化伙伴关系（PFI-TT）项目的更广泛的影响/商业潜力是追求研究和开发，重点是更有效地从电子设备中去除产生的热量，从而实现功率半导体电子新热管理技术的商业化。对电力电子的需求预计将很高，并将继续增长，特别是在国防、运输和替代能源部门，以及能源生产和分配、混合动力/电动汽车和超高效率照明系统。该项目将直接有利于开发新型紧凑、轻量化和高可靠性的电力电子设备。此外，该项目的成功完成可能会导致相关的运营成本降低、能源消耗降低、效率提高和碳足迹降低。最后，通过成立初创公司或技术转让协议，以及培训创新和创业方面的学生和博士后，使这项技术成功商业化，将有助于在用于高科技产品的电力电子领域取得全球领导地位。由于使用导热性差的散热器/界面材料从设备的背面或基板侧提取热量，目前的电力电子热管理方法受到限制。这个项目通过商业化一种新型的基于金刚石材料的技术来解决这个技术问题，这种技术可以直接从产生热量的电力电子设备的顶部提取热量。该方法基于使用金刚石薄膜，因为它具有高导热性和电阻率，非常适合热管理。直接从设备顶部提取热量可以提高40%的效率，并减少包装的尺寸和重量。从顶部提取热量也提供了更高的效率，降低了运行成本，同时增加了设备的使用寿命和密度。该项目的另一个目标是通过国家科学基金会的I-Corps团队培训来培训技术商业化和创业方面的工作人员，在该团队培训中，从事该项目的教师（技术领导）、导师和企业家领导（博士后和/或学生）将接受关于如何成功地将这一有前途的技术商业化的强化培训。这项新技术可能会带来更高效的电力电子产品、更低的运营成本、更长的设备寿命和密度，以及成功的技术商业化和创业精神。该奖项反映了美国国家科学基金会的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

The broader impact/commercial potential of this Partnerships for Innovation - Technology Translation (PFI-TT) project is to pursue research and development that focuses on the more efficient removal of generated heat from electronic devices leading to commercialization of a new thermal management technology for power semiconductor electronics. Demand for power electronics is expected to be high and continues to grow especially in the defense, transportation, and alternative energy sectors, as well as the energy generation and distribution, hybrid/electric vehicles, and ultra-high efficiency lighting systems. There will be direct benefits of the project towards the development of new compact, lightweight, and higher reliability power electronic devices. In addition, successful completion of this project may result in an associated reduction in cost of operation, lower energy consumption, increased efficiency, and a lower carbon footprint. Finally, successful commercialization of the technology through the establishment of a start-up company or tech-transfer agreement and the training of students and a postdoctoral fellow in innovation and entrepreneurship will contribute to global leadership in power electronics for high-technology products.The current approach to thermal management for power electronics is limited due to heat extraction from the back or substrate side of the device using heat spreader/interface materials of poor thermal conductivity. This project addresses this technological problem by commercializing a novel diamond material-based technology to extract heat directly from the top of the power electronics where heat is generated. The approach is based on using a diamond film because it is well-suited for thermal management because of its high thermal conductivity and electrical resistivity. The extraction of heat directly from the top of a device can enhance efficiency by 40% and reduce package size and weight. The extraction of heat from the top also offers higher efficiency and reduced operating costs, while increasing device lifetimes and density. Another objective of the project is to train the work force in technology commercialization and entrepreneurship through NSF’s I-Corps Team Training in which the faculty (technical lead), a mentor and an entrepreneur lead (post doc and/or student) working on the project are taken through intensive training on how to successfully commercialize this promising technology. The new technology may lead to more efficient power electronics, lower operating costs, enhanced device lifetimes and density, and successful technology commercialization and entrepreneurship.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.