Development of High Performance Insulating Materials Using Polymer Nanocomposites with Inorganic Fillers

我们已经证明，抗电化学迁移的环氧树脂用作印刷线路板，可以通过添加少量的二氧化硅纳米填料得到改善。基于这一结果，我们获得了三项专利。其次，将铁纳米粒子填充到环氧树脂中，开发了具有低涡流损耗、高介电常数和高磁导率的绝缘材料。复电模量是复介电常数的倒数。弛豫现象，由于在聚合物中的电荷传输，这是占主导地位的在低频范围内，变得明显，显示频率依赖的电模量谱。我们已经对各种聚合物进行了这种分析，并在论文中总结了结果，目前正在审查中。还对几种聚合物进行了太赫兹频率下的时域光谱测量，并通过量子化学计算对结果进行了分析。

We have demonstrated that the resistance against electrochemical migration of epoxy resin used as a printed wiring board can be improved by adding a small amount of silica nanofillers. Three patents were submitted based on this result. Next, iron nanoparticles were filled into epoxy resin, which resulted in the development of insulating materials with low eddy-current loss, high permittivity, and high permeability.Complex electric modulus is the inverse of complex permittivity. Relaxation phenomena due to charge transport in polymer, which are dominant in a low frequency range, become evident by showing frequency-dependent electric modulus spectra. We have done this analysis for various polymers, and the results were summarized in papers, which are now under review. Time-domain spectroscopic measurements at THz frequencies were also done for several polymers, and the results were analyzed by quantum chemical calculations.