Incorporation of Plasma Etching Experiments in UndergraduateMicroelectronics Fabrication Laboratory at University of New Mexico

将等离子蚀刻实验纳入新墨西哥大学本科生微电子制造实验室

• 批准号: 9151962
• 负责人: Charles Fleddermann
• 金额: $ 2.55万
• 依托单位: University of New Mexico
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1991
• 资助国家: 美国
• 起止时间: 1991-08-01 至 1994-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9151962&HistoricalAwards=false
• 关键词: Incorporation; Plasma; Etching; Experiments; UndergraduateMicroelectronics

Plasma etching has become an invaluable tool in the fabrication of modern microelectronic integrated circuits, making possible the high packing density of electronic components that has become standard in modern circuitry. Many colleges and universities offer laboratory courses designed to give undergraduate students "hands-on" experience with fabricating microelectronic components. However, these courses ignore plasma etching in favor of the easier, but no longer industrially useful, wet-chemical etch methods, leaving the graduating engineer with limited knowledge and no practical experience in plasma processing of semiconductors. This project incorporates experimental work in the undergraduate microelectronics laboratory designed to give students a knowledge of basic plasma processing equipment, to teach students techniques for etching semiconductor materials, and to facilitate the students' understanding of fundamental plasma processes and diagnostic techniques. Diagnostic tools suitable for use in an undergraduate laboratory allow the student to understand the processes taking place in the plasma, as well as to evaluate the results of plasma etching of materials. Using this equipment, students perform a series of experiments learning the characteristics of rf plasma systems, perform some easy diagnostic studies, and evaluate the results of etching of various semiconductor materials. A relatively modest capital expenditure provides the student with an in-depth knowledge of plasma etching, and its implementation in the semiconductor industry.

等离子体蚀刻已成为制造中的无价工具 现代微电子集成电路， 电子元件的高封装密度， 成为现代电路的标准。 许多学院和 大学提供实验室课程， 本科生“动手”制作经验 微电子元件 然而，这些课程忽视了 等离子体蚀刻有利于更容易，但不再 工业上有用的湿化学蚀刻方法，留下 毕业工程师，知识有限， 有半导体等离子体加工经验。这个项目 将实验工作纳入本科 微电子实验室旨在为学生提供 等离子体加工设备的基本知识，以教 学生蚀刻半导体材料的技术，并 促进学生对基本等离子体的理解 过程和诊断技术。 适用的诊断工具 用于本科实验室，允许学生 了解等离子体中发生的过程，以及 以评估材料的等离子体蚀刻的结果。 使用 学生们利用这台设备进行了一系列的实验 了解射频等离子体系统的特点， 简单的诊断研究，并评估蚀刻的结果， 各种半导体材料。一个相对温和的资本 费用为学生提供了深入的知识， 等离子体蚀刻及其在半导体中的实施 行业