Engineering Faculty Internship: Quantifying Plasma Generated Particle and Charge Build Up Damage in Submicron Manufacturing

这项拟议的工作将解决两个相互关联的问题：不受欢迎的基于等离子体的粒子产生和等离子体对底层设备的损害。这两项建议的研究都强烈影响制造中的工作模具良率，并共享等离子环境的共同问题。最初的重点将是聚合物光致抗蚀剂的等离子灰化，它在制造周期中发生10-15次，因此被用来提高生产率。通过光学方法测量的原位等离子体条件将与晶片上的后处理颗粒分布以及对器件结构的等离子体损伤相关联。如果取得成功，将使半导体器件的生产获得更高的产量和更高的生产率。

The propose work will address two interrelated issues: undesired plasma based particle generation and plasma created damage to underlying devices. Both proposed studies strongly impact the yield of working die in manufacturing and share the common issues of a plasma environment. The initial focus will be in plasma ashing of polymer photoresist which occurs 10 - 15 times in the manufacturing cycle and is therefore leveraged to productivity. In-situ plasma conditions as measured by optical methods will be correlated with post-process particle distributions on wafers as well as plasma damage to device structures. If successful to results will allow higher yields and greater productivity in the production of semiconductor devices.