Engineering Faculty Internship: Quantifying Plasma Generated Particle and Charge Build Up Damage in Submicron Manufacturing

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The propose work will address two interrelated issues: undesired plasma based particle generation and plasma created damage to underlying devices. Both proposed studies strongly impact the yield of working die in manufacturing and share the common issues of a plasma environment. The initial focus will be in plasma ashing of polymer photoresist which occurs 10 - 15 times in the manufacturing cycle and is therefore leveraged to productivity. In-situ plasma conditions as measured by optical methods will be correlated with post-process particle distributions on wafers as well as plasma damage to device structures. If successful to results will allow higher yields and greater productivity in the production of semiconductor devices.