Engineering Faculty Internship: Quantifying Plasma Generated Particle and Charge Build Up Damage in Submicron Manufacturing

拟议工作将处理两个相互关联的问题： 不希望的基于等离子体的颗粒产生和产生的等离子体 对底层设备的损坏。 两项研究都强烈建议 影响加工模具的成品率， 等离子体环境的常见问题。 最初的重点将是 在聚合物光致抗蚀剂的等离子体灰化中 在制造周期中，因此可以利用 生产力 通过光学测量的原位等离子体条件 方法将与后处理颗粒分布相关 以及等离子体对器件结构的损伤。 如果成功的结果将允许更高的产量和更大的 提高半导体器件生产的生产率。

The propose work will address two interrelated issues: undesired plasma based particle generation and plasma created damage to underlying devices. Both proposed studies strongly impact the yield of working die in manufacturing and share the common issues of a plasma environment. The initial focus will be in plasma ashing of polymer photoresist which occurs 10 - 15 times in the manufacturing cycle and is therefore leveraged to productivity. In-situ plasma conditions as measured by optical methods will be correlated with post-process particle distributions on wafers as well as plasma damage to device structures. If successful to results will allow higher yields and greater productivity in the production of semiconductor devices.