Engineering Faculty Internship: Quantifying Plasma Generated Particle and Charge Build Up Damage in Submicron Manufacturing

提议的工作将解决两个相互关联的问题：不希望的基于等离子体的粒子产生和等离子体对底层设备的损害。这两项研究都强烈影响了制造过程中工作模具的良率，并分享了等离子体环境的共同问题。最初的重点将放在聚合物光刻胶的等离子体灰化上，这在制造周期中会发生10 - 15次，因此可以提高生产率。通过光学方法测量的原位等离子体条件将与加工后晶圆上的粒子分布以及等离子体对器件结构的损伤相关。如果成功的结果将允许更高的产量和更高的生产率在半导体器件的生产。

The propose work will address two interrelated issues: undesired plasma based particle generation and plasma created damage to underlying devices. Both proposed studies strongly impact the yield of working die in manufacturing and share the common issues of a plasma environment. The initial focus will be in plasma ashing of polymer photoresist which occurs 10 - 15 times in the manufacturing cycle and is therefore leveraged to productivity. In-situ plasma conditions as measured by optical methods will be correlated with post-process particle distributions on wafers as well as plasma damage to device structures. If successful to results will allow higher yields and greater productivity in the production of semiconductor devices.