Electron Beam Curing of Polymer Resists

软真空产生电子的束物理， 硬化、干式显影和电子等离子体化学 诱导聚合物变化将以统一的方式进行检查。 软 真空电子束源的特点，充分 考虑到光束能量谱的修改， 背景气体 众所周知，电子敏感聚合物和 新的聚合物将使用适当的气体介质进行加工， 增强聚合物表面化学和气化反应。 该技术有望提高固化速度， 半导体抗蚀剂图案的图案分辨率 用于微电子加工。 这可以允许增加 电路密度 在电子和半导体领域的应用 将与工业合作者探讨制造业。

The beam physics of soft vacuum generated electrons, the plasma chemistry of hardening and dry development and electron- induce polymer changes will be examined in a unified manner. Soft vacuum electron beam sources will be characterized, fully accounting for modification of the beam energy spectrum by the background gas. Both well known, electron-sensitive polymers and new polymers will be processed using appropriate gaseous media that enhance polymer surface chemistry and gasification reactions. The techniques promises to increase the curing speed and pattern resolution of the semiconductor resist patterns which are used in microelectronic processing. This may allow increased circuit density. Applications in electronic and semiconductor manufacturing will be explored with industrial collaborators.