Electron Beam Curing of Polymer Resists

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The beam physics of soft vacuum generated electrons, the plasma chemistry of hardening and dry development and electron- induce polymer changes will be examined in a unified manner. Soft vacuum electron beam sources will be characterized, fully accounting for modification of the beam energy spectrum by the background gas. Both well known, electron-sensitive polymers and new polymers will be processed using appropriate gaseous media that enhance polymer surface chemistry and gasification reactions. The techniques promises to increase the curing speed and pattern resolution of the semiconductor resist patterns which are used in microelectronic processing. This may allow increased circuit density. Applications in electronic and semiconductor manufacturing will be explored with industrial collaborators.