Systematic Development and Testing for Reliable Electronic Packaging of Surface Micromachined sm-MEMS Devices
Systematic Development and Testing for Reliable Electronic Packaging of Surface Micromachined sm-MEMS Devices
批准号:
9900013
负责人:
Ajay Malshe
金额:
$19.12万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1999
资助国家:
美国
项目状态:
已结题
起止时间:
1999-06-01 至 2003-05-31
中文摘要
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英文摘要
9900013SinghThe PI proposes to design, test and develop schemes for (1) safe die handling, (2) die attachment with least stress and (3) near outgassing-free die attachment for reliable electronic packaging of surface micromachined microelectromechanical systems (sm-MEMS). The objective is to work towards establishing an infrastructure for reliable packaging of MEMS, which is crucial for the successful commercial realization of these devices. The proposed program will be executed in a collaboration between High Density Electronics Center (HiDEC) at the University of Arkansas, and MEMS packaging group at Sandia National Laboratories (SNL).***
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