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Systematic Development and Testing for Reliable Electronic Packaging of Surface Micromachined sm-MEMS Devices

Systematic Development and Testing for Reliable Electronic Packaging of Surface Micromachined sm-MEMS Devices
表面微机械加工 sm-MEMS 器件的可靠电子封装的系统开发和测试
批准号:
9900013
负责人:
Ajay Malshe
金额:
$19.12万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1999
资助国家:
美国
项目状态:
已结题
起止时间:
1999-06-01 至 2003-05-31

项目摘要

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中文摘要
翻译
9900013SinghPI建议设计、测试和开发用于表面微机械微机械系统(sm-MEMS)可靠电子封装的(1)安全模具处理、(2)应力最小的模具附件和(3)接近无出气的模具附件的方案。目标是为MEMS的可靠封装建立基础设施,这对这些设备的成功商业实现至关重要。拟议的计划将由阿肯色大学的高密度电子中心(HiDEC)和桑迪亚国家实验室(SNL)的MEMS封装小组合作执行。*
英文摘要
9900013SinghThe PI proposes to design, test and develop schemes for (1) safe die handling, (2) die attachment with least stress and (3) near outgassing-free die attachment for reliable electronic packaging of surface micromachined microelectromechanical systems (sm-MEMS). The objective is to work towards establishing an infrastructure for reliable packaging of MEMS, which is crucial for the successful commercial realization of these devices. The proposed program will be executed in a collaboration between High Density Electronics Center (HiDEC) at the University of Arkansas, and MEMS packaging group at Sandia National Laboratories (SNL).***
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  • 财政年份:
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国内基金
海外基金
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