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Systematic Development and Testing for Reliable Electronic Packaging of Surface Micromachined sm-MEMS Devices

Systematic Development and Testing for Reliable Electronic Packaging of Surface Micromachined sm-MEMS Devices
表面微机械加工 sm-MEMS 器件的可靠电子封装的系统开发和测试
批准号:
9900013
负责人:
Ajay Malshe
金额:
$19.12万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1999
资助国家:
美国
项目状态:
已结题
起止时间:
1999-06-01 至 2003-05-31

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中文摘要
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英文摘要
9900013SinghThe PI proposes to design, test and develop schemes for (1) safe die handling, (2) die attachment with least stress and (3) near outgassing-free die attachment for reliable electronic packaging of surface micromachined microelectromechanical systems (sm-MEMS). The objective is to work towards establishing an infrastructure for reliable packaging of MEMS, which is crucial for the successful commercial realization of these devices. The proposed program will be executed in a collaboration between High Density Electronics Center (HiDEC) at the University of Arkansas, and MEMS packaging group at Sandia National Laboratories (SNL).***
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  • 项目类别:
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  • 资助金额:
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  • 财政年份:
    2020
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  • 批准号:
    0738380
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    Standard Grant
  • 资助金额:
    $1.33万
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    2007
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  • 资助金额:
    $0.6万
  • 财政年份:
    2006
  • 负责人:
    Ajay Malshe
  • 依托单位:
国内基金
海外基金
水稻边界发育缺陷突变体abnormal boundary development(abd)的基因克隆与功能分析
Development of a Linear Stochastic Model for Wind Field Reconstruction from Limited Measurement Data
  • 批准号:
    --
  • 项目类别:
    --
  • 资助金额:
    40万元
  • 批准年份:
    2020
  • 负责人:
    Vikrant Gupta
  • 依托单位: