GOALI: Wafer-Level and Chip-Scale Packaging (WL-CSP) of MEMS

GOALI：MEMS 晶圆级和芯片级封装 (WL-CSP)

• 批准号: 0501597
• 负责人: Ajay Malshe
• 金额: --
• 依托单位: University of Arkansas
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2005
• 资助国家: 美国
• 起止时间: 2005-06-01 至 2010-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0501597&HistoricalAwards=false
• 关键词: GOALI; Wafer; Level; Chip; Scale

The objective of this research is to design, develop and test a novel wafer-level encapsulation and chip-scale interconnection scheme for packaging of micro electromechanical systems. Arrays of radio frequency micro electromechanical system switch devices on a wafer are chosen as a demonstration test bed. The goal is to implement and test capping high resistivity silicon, polymer and low temperature co-fired ceramic wafers, with through wafer metallized vias for encapsulation and interconnection of radio frequency micro electromechanical system switches on the device wafer. This project will be executed in an ongoing collaboration among the University of Arkansas, wiSpry, and Sandia National Laboratories. The success of the proposed technical approach will allow the industry to work on a wide gamut of micro electromechanical system devices operational in hermetic environments. These developments benefit micro electromechanical system packaging in strategic application areas of telecommunication, homeland security, biomedical devices, automotive and aerospace sensors, thin display and solid state lighting applications and fuel cells. The interdisciplinary expertise of the team will be conducive for the microsystems education of the students involved on this project. In the research, the special emphasis will be to recruit and nurture teaching, training and learning within underrepresented minorities. Investigators will continue to build their ongoing partnership with area school community and the experience will used to forge new relations with the area Community Colleges. Training is inevitable today- to the technology community particularly in the Midwest- to create and retain new high paid microsystems related jobs in America.

本研究的目的是设计、开发和测试一种新的晶圆级封装和芯片级互连方案，用于微机电系统的封装。选择晶片上的射频微机电系统开关器件阵列作为演示实验平台。目标是实现和测试覆盖高电阻率硅，聚合物和低温共烧陶瓷晶片，通过晶片金属化过孔的封装和互连的射频微机电系统开关的设备晶片。 该项目将在阿肯色州大学、wiSpry和桑迪亚国家实验室的持续合作下执行。所提出的技术方法的成功将允许工业界在密封环境中操作的各种微机电系统设备上工作。这些发展有利于电信、国土安全、生物医学设备、汽车和航空航天传感器、薄显示器和固态照明应用以及燃料电池等战略应用领域的微机电系统封装。该团队的跨学科专业知识将有利于参与该项目的学生的微系统教育。在研究中，将特别强调在代表性不足的少数群体中招聘和培养教师、培训和学习。 调查人员将继续与地区学校社区建立持续的伙伴关系，并将利用这些经验与地区社区学院建立新的关系。培训是不可避免的今天-技术社区，特别是在中西部-创造和保留新的高薪微系统相关的工作在美国。