GOALI: Wafer-Level and Chip-Scale Packaging (WL-CSP) of MEMS

GOALI:MEMS 晶圆级和芯片级封装 (WL-CSP)

基本信息

  • 批准号:
    0501597
  • 负责人:
  • 金额:
    --
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2005
  • 资助国家:
    美国
  • 起止时间:
    2005-06-01 至 2010-12-31
  • 项目状态:
    已结题

项目摘要

The objective of this research is to design, develop and test a novel wafer-level encapsulation and chip-scale interconnection scheme for packaging of micro electromechanical systems. Arrays of radio frequency micro electromechanical system switch devices on a wafer are chosen as a demonstration test bed. The goal is to implement and test capping high resistivity silicon, polymer and low temperature co-fired ceramic wafers, with through wafer metallized vias for encapsulation and interconnection of radio frequency micro electromechanical system switches on the device wafer. This project will be executed in an ongoing collaboration among the University of Arkansas, wiSpry, and Sandia National Laboratories. The success of the proposed technical approach will allow the industry to work on a wide gamut of micro electromechanical system devices operational in hermetic environments. These developments benefit micro electromechanical system packaging in strategic application areas of telecommunication, homeland security, biomedical devices, automotive and aerospace sensors, thin display and solid state lighting applications and fuel cells. The interdisciplinary expertise of the team will be conducive for the microsystems education of the students involved on this project. In the research, the special emphasis will be to recruit and nurture teaching, training and learning within underrepresented minorities. Investigators will continue to build their ongoing partnership with area school community and the experience will used to forge new relations with the area Community Colleges. Training is inevitable today- to the technology community particularly in the Midwest- to create and retain new high paid microsystems related jobs in America.
本研究的目的是设计、开发和测试一种用于微电子机械系统封装的新型晶圆级封装和芯片级互连方案。选择硅片上的射频微机电系统开关器件阵列作为演示试验台。其目标是实现和测试高阻硅、聚合物和低温共烧陶瓷晶片的封顶,以及用于封装和互连设备晶片上的射频微机电系统开关的贯穿晶片金属化过孔。该项目将在阿肯色大学、威斯普里大学和桑迪亚国家实验室之间的持续合作中实施。拟议的技术方法的成功将使该行业能够在密闭环境中工作的微型机电系统设备的广泛范围内工作。这些发展有利于电信、国土安全、生物医疗设备、汽车和航空航天传感器、薄型显示器和固态照明应用以及燃料电池等战略应用领域的微型机电系统封装。该小组的跨学科专业知识将有助于对参与该项目的学生进行微系统教育。在这项研究中,将特别强调在代表性不足的少数群体中招聘和培养教学、培训和学习。调查人员将继续与地区学校社区建立持续的伙伴关系,并将利用这些经验与地区社区学院建立新的关系。如今,培训是不可避免的,尤其是对中西部的科技界来说,在美国创造和保留新的高薪微系统相关工作岗位是不可避免的。

项目成果

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专利数量(0)

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Ajay Malshe其他文献

Ajay Malshe的其他文献

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{{ truncateString('Ajay Malshe', 18)}}的其他基金

RAPID: Ionic Modulation of COVID Through Ceramic Surfaces for Deactivation
RAPID:通过陶瓷表面对 COVID 进行离子调制以使其失活
  • 批准号:
    2031199
  • 财政年份:
    2020
  • 资助金额:
    --
  • 项目类别:
    Standard Grant
Collaborative Research: Design and Fundamental Understanding of Advanced Minimum Quantity Lubrication (MQL) Machining using Nanolubricants
合作研究:使用纳米润滑剂进行先进微量润滑 (MQL) 加工的设计和基本理解
  • 批准号:
    0927541
  • 财政年份:
    2009
  • 资助金额:
    --
  • 项目类别:
    Standard Grant
Workshop/Collaborative Research: Grand Challenges for Bio-Nano Integrated Manufacturing for Year 2020; October 3-5, 2007; Arlington, Virginia
研讨会/合作研究:2020年生物纳米集成制造的巨大挑战;
  • 批准号:
    0738380
  • 财政年份:
    2007
  • 资助金额:
    --
  • 项目类别:
    Standard Grant
Collaborative Workshop on Bio-Nano Manufacturing for Cellular Engineering; March, 2007; NIST, Gaithersburg, Maryland
细胞工程生物纳米制造合作研讨会;
  • 批准号:
    0650106
  • 财政年份:
    2006
  • 资助金额:
    --
  • 项目类别:
    Standard Grant
GOALI: Mechanically Biased Self-Assembly of 2-D and 3-D Quantum Structures Using a Novel Nanostamping Process
GOALI:使用新型纳米冲压工艺进行 2D 和 3D 量子结构的机械偏置自组装
  • 批准号:
    0600707
  • 财政年份:
    2006
  • 资助金额:
    --
  • 项目类别:
    Standard Grant
SGER: SMART Integrated System for Water Health Monitoring and Decontamination: Addressing Aftermath of Hurricane Katrina and Alike Situations
SGER:用于水健康监测和净化的智能集成系统:解决卡特里娜飓风和类似情况的后果
  • 批准号:
    0635412
  • 财政年份:
    2006
  • 资助金额:
    --
  • 项目类别:
    Standard Grant
Collaborative Research: SGER: Feasibility of a New Nano-Composite cBN Coating Method for Next Generation Cutting Tools for Harsh Hard Machining
合作研究:SGER:新型纳米复合材料 cBN 涂层方法的可行性,用于下一代严酷硬加工切削刀具
  • 批准号:
    0548417
  • 财政年份:
    2005
  • 资助金额:
    --
  • 项目类别:
    Standard Grant
Collaborative Research: Development Of Nano-Electrical Discharge Machining (NANO-EDM) For Advanced Manufacturing
合作研究:开发用于先进制造的纳米放电加工(NANO-EDM)
  • 批准号:
    0423698
  • 财政年份:
    2004
  • 资助金额:
    --
  • 项目类别:
    Standard Grant
SGER: Explore Feasibility of a Novel Nano Mechanical Machining System-on-a-Chip (SOAC) for Nano Manufacturing
SGER:探索用于纳米制造的新型纳米机械加工片上系统 (SOAC) 的可行性
  • 批准号:
    0236465
  • 财政年份:
    2002
  • 资助金额:
    --
  • 项目类别:
    Standard Grant
NSF Tri-National Workshop - Advances in Micro and Nano Technologies for Sensing Applications
NSF 三国研讨会 - 传感应用微纳米技术的进展
  • 批准号:
    0307610
  • 财政年份:
    2002
  • 资助金额:
    --
  • 项目类别:
    Standard Grant

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Capability for wafer-level sub-nanometre scale imaging
晶圆级亚纳米级成像能力
  • 批准号:
    EP/X041166/1
  • 财政年份:
    2023
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  • 批准号:
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合作研究:用于半导体晶圆级制造的数据驱动计量和检测技术
  • 批准号:
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用于 5G 通信网络的可重构毫米波滤波器和使用小型化单片晶圆级波导的系统
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