Energy Release, Chemical Selectivity, and Stereochemistry of Interhalogen Reactions with Low Work Function Surfaces

该研究项目涉及非绝热气体-表面相互作用的基本机制。 在分析和表面化学计划的支持下，Andrew Kummel教授和他在加州大学圣地亚哥分校的同事正在进行卤素和卤素间分子与低功函数表面（如Al（111））相互作用的解离吸附的详细实验研究。 本文用速度相关的二卤分子束和卤间分子束研究了远距离解离和吸收化学吸附的机理。 散射卤素原子的速度分布，再加上扫描探针显微镜检查的反应表面的能量分配和机制，在这些研究中提供的细节。 取向互卤分子的相互作用也检查。 除了获得有关表面非绝热过程的基本见解外，这项工作还提供了有关电子材料干法蚀刻的信息。在低功函数表面上发生的卤素蚀刻反应的机制是UCSD的Kummel教授和同事进行的这个研究项目的重点。 使用分子束方法的组合，激光光谱表征的散射物种，和扫描探针显微镜来表征反应的表面，卤素基等离子体增强蚀刻工艺的详细信息。 这项基础研究对电子材料蚀刻工艺的发展产生了广泛的影响，并为一类重要的表面反应机制提供了基本的见解。

This research project addresses the fundamental mechanisms of non-adiabatic gas-surface interactions. With the support of the Analytical and Surface Chemistry Program, Professor Andrew Kummel and his coworkers at UC-San Diego are carrying out detailed experimental studies of the dissociative adsorption of halogen and interhalogen molecules interacting with low work function surfaces such as Al(111). Velocity dependent molecular beams of dihalogens and interhalogens are used to probe the mechanisms of remote dissociative and abstractive chemisorption. Velocity distributions of scattered halogen atoms, coupled with scanning probe microscopic examination of the reacted surface provide the details of energy partitioning and mechanism in these studies. The interaction of oriented interhalogen molecules is also examined. In addition to the fundamental insights obtained concerning non-adiabatic processes at surfaces, information relevant to the dry etching of electronic materials results from this work. The mechanisms of halogen etching reactions taking place on low work function surfaces is the focus of this research project carried out by Professor Kummel and coworkers at UCSD. Using a combination of molecular beam methods, laser spectroscopic characterization of scattered species, and scanning probe microscopy to characterize the reacted surface, detailed information about halogen based plasma enhanced etching processes is obtained. This fundamental research has broad impact on the development of electronic materials etching processes, as well as providing fundamental insight into the mechanisms of an important class of surface reactions.