SBIR PHASE I: A Spin-Processing Module for High Speed Ozone-Water Based Resist and Residue Removal

这个小型企业创新研究第一阶段项目旨在开发一种用于半导体器件制造中高速臭氧水基抗蚀剂和残留物去除的单晶片旋转处理模块。一种新的臭氧-水工艺已经被开发出来，这种工艺在单晶片加工配置中具有独特的实际生产能力。实验和分析工作表明，通过改进旋转处理模块的设计，有可能显著提高该工艺的刻蚀速率和刻蚀均匀性。第一阶段确定了四个目标：(1)使用标准的商业旋转处理模块测量刻蚀速率随关键工艺参数的径向关系；(2)开发模块的计算流体动力学模型；(3)通过将测量的刻蚀速率与模型预测的刻蚀速率进行比较来验证模型；以及(4)使用该模型对有前景的新型旋转处理器设计进行初步评估。单基板湿法加工在晶圆加工、磁盘制造、光盘制造和平板显示器制造中都有应用。预计到2005年，仅硅片湿法加工设备的市场规模就将达到31亿美元。单晶片湿法加工领域正在增长，预计到2005年将达到3亿至4.5亿美元。

This Small Business Innovation Research Phase I project is directed to the development of a single-wafer spin processing module for high-speed ozone-water-based resist and residue removal in semiconductor device manufacturing. A new ozone-water process which is unique in promising practical throughputs in single-wafer processing configurations has been developed. Experimental and analytical work has shown there is an opportunity to significantly increase the etch rate and etch uniformity of this process with improvements in the design of the spin processing module. Four goals are established for this Phase I: (1) Measure the radial dependence of the etch rate as a function of key process parameters using a standard commercial spin processing module; (2) Develop a computational fluid dynamic model of the module; (3) Validate the model by comparing the measured etch rate to that predicted by the model; and, (4) Use the model to make a preliminary evaluation of promising new spin processor designs. Single-substrate wet processing has applications in wafer processing, magnetic disc manufacturing, optical disc manufacturing, and flat panel display manufacturing. The market for wafer wet processing equipment alone is projected to reach 3.1 billion dollars by 2005. The single-wafer wet processing segment is growing and is expected to be between 300 million to 450 million dollars by 2005.