权益分类	功能权益	普通用户	{{item.name}}会员
{{category.name}}	{{benefitItem.name}}

SBIR PHASE I: A Spin-Processing Module for High Speed Ozone-Water Based Resist and Residue Removal

SBIR PHASE I：用于高速臭氧水基抗蚀剂和残留物去除的旋转处理模块

基本信息

批准号：
0320322
负责人：
David Boyers
金额：
$ 10万
依托单位：
Phifer Smith Corporation
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
2003
资助国家：
美国
起止时间：
2003-07-01 至 2003-12-31
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=0320322&HistoricalAwards=false
关键词：
SBIR PHASE Spin Processing Module

项目摘要

This Small Business Innovation Research Phase I project is directed to the development of a single-wafer spin processing module for high-speed ozone-water-based resist and residue removal in semiconductor device manufacturing. A new ozone-water process which is unique in promising practical throughputs in single-wafer processing configurations has been developed. Experimental and analytical work has shown there is an opportunity to significantly increase the etch rate and etch uniformity of this process with improvements in the design of the spin processing module. Four goals are established for this Phase I: (1) Measure the radial dependence of the etch rate as a function of key process parameters using a standard commercial spin processing module; (2) Develop a computational fluid dynamic model of the module; (3) Validate the model by comparing the measured etch rate to that predicted by the model; and, (4) Use the model to make a preliminary evaluation of promising new spin processor designs. Single-substrate wet processing has applications in wafer processing, magnetic disc manufacturing, optical disc manufacturing, and flat panel display manufacturing. The market for wafer wet processing equipment alone is projected to reach 3.1 billion dollars by 2005. The single-wafer wet processing segment is growing and is expected to be between 300 million to 450 million dollars by 2005.

该小型企业创新研究第一阶段项目旨在开发用于半导体器件制造中高速臭氧-水基抗蚀剂和残留物去除的单晶圆自旋处理模块。开发了一种新的臭氧-水工艺，该工艺在单晶圆处理配置中具有独特的实际吞吐量。实验和分析工作表明，通过改进旋转处理模块的设计，可以显著提高该工艺的蚀刻速率和蚀刻均匀性。第一阶段确定了四个目标：(1)使用标准的商用自旋加工模块测量蚀刻速率作为关键工艺参数的径向依赖性；(2)建立模块的计算流体力学模型；(3)通过将测量的蚀刻速率与模型预测的蚀刻速率进行比较来验证模型；(4)利用该模型对有前景的新型自旋处理机设计进行初步评价。单衬底湿法加工在晶圆加工、光盘制造、光盘制造、平板显示器制造等领域都有应用。到2005年，仅湿法加工设备的市场规模就将达到31亿美元。单晶圆湿法加工领域正在增长，预计到2005年将达到3亿至4.5亿美元。