An Analysis of Anisotropic Etching Process and Prediction of Finished Profile

单晶纯硅具有与钢相当的很高的力学性能，但由于其很难通过切割操作进行精确加工，因此它在机械零件上的应用并不广泛，为此，利用单晶的各向异性特性，经常使用蚀刻方法。各向异性特性从根本上决定了组成成品形状的面的取向，但加工后的轮廓与掩模的轮廓并不总是一致的，这限制了工艺的应用，通过实验明确了各种条件下的各向异性刻蚀机理，并经验地建立了各刻蚀条件与工艺参数之间的关系。然后，基于这些关系建立工艺的计算机模拟，通过该计算机模拟现在可以预见任何给定掩模的成品轮廓。

Single crystalized pure silicon possesses very high mechanical properties which are equivalent to those of steels, nevertheless, it is not widely applied to the mechanical component because of its difficulty to machine precisely by cutting operation.On behalf of this, etching is often used in which anisotropic characteristic of single crystal is used. The orientation of faces to compose the shape of finished workpiece can be fundamentally decided by the anisotropic characteristic, however, the finished profile does not always coincide with that of mask, which limits the utilization of the process.This study makes the anisotropic etching mechanism clear through the experiments under a variety of conditions, and the relation between each etching condition with the process parameters is established empirically. Then, the computer simulation of the process is established based on these relations, by which it becomes possible to foresee the finished profile for any given mask now.