Development of High Performance Insulating Materials Using Polymer Nanocomposites with Inorganic Fillers

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We have demonstrated that the resistance against electrochemical migration of epoxy resin used as a printed wiring board can be improved by adding a small amount of silica nanofillers. Three patents were submitted based on this result. Next, iron nanoparticles were filled into epoxy resin, which resulted in the development of insulating materials with low eddy-current loss, high permittivity, and high permeability.Complex electric modulus is the inverse of complex permittivity. Relaxation phenomena due to charge transport in polymer, which are dominant in a low frequency range, become evident by showing frequency-dependent electric modulus spectra. We have done this analysis for various polymers, and the results were summarized in papers, which are now under review. Time-domain spectroscopic measurements at THz frequencies were also done for several polymers, and the results were analyzed by quantum chemical calculations.