Hierarchical multi-scale thermal transport from nano to macro scales

从纳米尺度到宏观尺度的分层多尺度热传输

• 批准号: 356090-2009
• 负责人: Amon, Cristina
• 金额: $ 4.7万
• 依托单位: University of Toronto
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2012
• 资助国家: 加拿大
• 起止时间: 2012-01-01 至 2013-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=515202
• 关键词: Hierarchical; multi; scale; thermal; transport

State of the art IT devices, such as semiconductor electronics, optoelectronics and data storage media, include components with dimensions in the nanometres, and are subject to intense and very brief heating pulses of picoseconds. Further advances in data storage densities, transistor and transmission speeds are strongly limited by issues related to heat transfer. These issues have only recently emerged as a consequence of increased densities and miniaturization of the device features into the nanometres. In the presence of hotspots and in thin metallic media, and in the nanoscale regime, the continuum Fourier assumption fails and the contributions of both phonons and electrons to heat transfer can no longer be neglected. To predict the thermal behaviour at all relevant scales, one needs to take into account device components with spatial dimensions from nanometres to centimetres and temporal scales from picoseconds to hours.

现有技术的IT设备，例如半导体电子设备、光电子设备和数据存储介质，包括具有纳米尺寸的部件，并且经受强烈且非常短暂的皮秒加热脉冲。 数据存储密度、晶体管和传输速度的进一步发展受到与热传递相关的问题的强烈限制。 这些问题只是最近才出现的结果，增加的密度和微型化的设备功能到纳米。在热点的存在下，在薄的金属介质中，在纳米级制度，连续傅立叶假设失败，声子和电子的传热的贡献不能再被忽略。为了预测所有相关尺度下的热行为，需要考虑空间尺寸从纳米到厘米，时间尺度从皮秒到小时的设备组件。