Ultra-Thin Silicon Wafer Bonding

9529616 Farmer该提案描述了在将超薄硅晶片（薄至2微米）粘合到原始和氧化硅衬底的领域中对专用设备的研究和需求。 粘接界面的完整性对于理解可靠性和失效机制的基本问题至关重要。 界面的质量将用红外显微镜检查，以确定退火温度和表面粗糙度的影响。 该技术的应用领域包括微机电系统（MEMS）、绝缘体上硅（SOI）和硅（SOS）。 ***

9529616 Farmer This proposal describes research and the need for specialized equipment in the area of bonding ultra-thin silicon wafers (as thin as 2 micrometers) to virgin and oxidized silicon substrates. The integrity of the bonded interface is of paramount importance in understanding the fundamental issues of reliability and failure mechanisms. The quality of the interface will be examined with an IR microscope to determine the effects of annealing temperature and surface roughness. The fields of application for this technology include Micro-Electro-Mechanical Systems (MEMS), Silicon on Insulator (SOI) and Silicon (SOS). ***