Energy Release, Chemical Selectivity, and Stereochemistry of Interhalogen Reactions with Low Work Function Surfaces

本研究项目探讨了非绝热气体-表面相互作用的基本机制。在分析和表面化学计划的支持下，加州大学圣地亚哥分校的Andrew Kummel教授和他的同事们正在对卤素和卤素间分子与低功函数表面(如Al(111))相互作用的解离吸附进行详细的实验研究。利用二卤素和卤间化合物的速度相关分子束研究了远程解离和抽象化学吸附的机理。散射卤素原子的速度分布，结合反应表面的扫描探针显微镜检查，提供了这些研究中能量分配和机理的细节。此外，还研究了定向卤素分子间的相互作用。除了获得关于表面非绝热过程的基本见解外，这项工作还产生了与电子材料干法蚀刻相关的信息。低功函数表面发生卤素刻蚀反应的机理是UCSD的Kummel教授及其同事开展的这项研究项目的重点。结合分子束方法、激光光谱散射物表征和扫描探针显微镜对反应表面进行表征，获得了基于卤素的等离子体增强刻蚀过程的详细信息。这一基础性研究对电子材料刻蚀工艺的发展具有广泛的影响，并对一类重要的表面反应的机理提供了基本的见解。

This research project addresses the fundamental mechanisms of non-adiabatic gas-surface interactions. With the support of the Analytical and Surface Chemistry Program, Professor Andrew Kummel and his coworkers at UC-San Diego are carrying out detailed experimental studies of the dissociative adsorption of halogen and interhalogen molecules interacting with low work function surfaces such as Al(111). Velocity dependent molecular beams of dihalogens and interhalogens are used to probe the mechanisms of remote dissociative and abstractive chemisorption. Velocity distributions of scattered halogen atoms, coupled with scanning probe microscopic examination of the reacted surface provide the details of energy partitioning and mechanism in these studies. The interaction of oriented interhalogen molecules is also examined. In addition to the fundamental insights obtained concerning non-adiabatic processes at surfaces, information relevant to the dry etching of electronic materials results from this work. The mechanisms of halogen etching reactions taking place on low work function surfaces is the focus of this research project carried out by Professor Kummel and coworkers at UCSD. Using a combination of molecular beam methods, laser spectroscopic characterization of scattered species, and scanning probe microscopy to characterize the reacted surface, detailed information about halogen based plasma enhanced etching processes is obtained. This fundamental research has broad impact on the development of electronic materials etching processes, as well as providing fundamental insight into the mechanisms of an important class of surface reactions.