Puled laser micro/submicro manufacturing for MEMS and microelectronics

电子学、光子学和生物医学设备的小型化推动了对微/亚微制造的不断增长的需求。该研究包括基础研究和应用研究工作，并以工业为导向，能够对MEMS和微电子行业产生重大影响。MEMS和微电子领域的主要挑战之一在于这些器件的小型化和制造。脉冲激光加工提供了独特的能力，生产特征在微/纳米尺度工业标准。拟议的研究计划在微/纳米技术中定义了一个独特的操作利基，这是其他技术无法实现的。通过这项研究获得的技术专长将是独特和创新的，可以开发新的和改进的产品。研究工作将集中在以下几个方面：1)微和亚微制造。研究和开发一种利用短脉冲激光进行亚微加工的替代技术。本文将深入研究两种基本的制造方法，即径向/切向偏振光效应和激光烧蚀和湿法蚀刻相结合的概念，用于微和亚微制造。在此基础上，建立了高重复频率激光烧蚀的黄斑模型和超短激光振荡器微纳制造的管理规则。基础研究将应用于薄晶片切割/模拟，提高效率，改善质量，高模具强度和更低的切口宽度。另一个应用是IC电路故障分析，通过在IC电路中逐层去除，而不会损坏底层结构，效率高，质量好，成本低。3)脉冲激光烧蚀制备纳米颗粒。纳米颗粒可以显著提高产品质量，并使新产品成为可能。在这项工作中，我们的目标是研究（纳米颗粒的形状和大小），提高转化效率，并使大规模生产纳米颗粒用于工业应用，特别是在飞机/汽车工业。

The drive for miniaturization in electronics, photonics and biomedical device is spurring an ever growing need for micro/sub micro manufacturing. The research encompasses fundamental and applied research work with an industrial orientation to be able to make significant impact on MEMS and micro electronics industries. One of the major challenges in the area of MEMS and micro electronics lies in miniaturization and fabrication of these devices. Pulsed laser processing provides unique capability for producing features in micro/nano scale to industrial standard. The proposed research program defines a unique operating niche in micro/nanotechnology that cannot be fulfilled by other technologies. The technical expertise gained through this research would be unique and innovative with which new and improved products can be developed. The research work will focus on the following projects: 1) Micro and sub micro manufacturing. Study and develop an alternative technique for sub-micro manufacturing using short pulsed laser. Two fundamental manufacturing methods, effect of radially/tangentially polarised light and the concept of combination of laser ablation and wet etching for micro and submicro manufacturing will be studied in depth. From the study a macular model for high repetition rate laser ablation and managing rules for ultrashort laser oscillator micro/nano manufacturing will be developed 2) Microelectronics and MEMS applications. The fundamental investigations will be applied for thin wafer Dicing/Singulation with increased efficiency, improved quality, high die strength and lower kerfwidth. The other application is for IC Circuit failure analysis, by layer-by-layer removal in an IC circuit without damaging the underlying structures at high efficiency, quality and lower cost. 3) Nanoparticle generation by pulsed laser ablation. Nanoparticles can significantly improve the quality of products and enables new products. In this work we aim to study (Nano particle shape and size) and improve the converting efficiency, and enable mass production of nanoparticles for industrial applications, especially in the aircraft/automobile industry.