Puled laser micro/submicro manufacturing for MEMS and microelectronics

电子、光电子和生物医学设备小型化的驱动，刺激了对微型/亚微型制造的日益增长的需求。这项研究包括基础和应用研究工作，以工业为导向，能够对MEMS和微电子行业产生重大影响。MEMS和微电子学领域的主要挑战之一是这些器件的小型化和制造。脉冲激光加工提供了独特的能力，可以按照工业标准制造微米/纳米级的特征。拟议的研究计划定义了微/纳米技术中一个独特的操作利基，这是其他技术无法实现的。通过这项研究获得的技术专门知识将是独特和创新的，可以用来开发新的和改进的产品。研究工作将集中在以下几个项目上：1)微米和亚微米制造。研究和开发一种使用短脉冲激光进行亚微米制造的替代技术。两种基本的制造方法，径向/切向偏振光的效应，以及激光烧蚀和湿法刻蚀相结合的概念将被深入研究，以用于微米和亚微米制造。通过这项研究，将开发高重复频率激光烧蚀的黄斑模型和超短激光振荡器微/纳米制造的管理规则2)微电子学和MEMS的应用。基础研究将应用于提高效率、改善质量、高模具强度和较低切宽的薄片切割/单晶。另一种应用是通过在IC电路中逐层移除而不损害底层结构，以高效率、高质量和低成本的方式进行IC电路故障分析。3)脉冲激光烧蚀产生纳米粒子。纳米粒子可以显著提高产品的质量，并使新产品成为可能。在这项工作中，我们的目标是研究纳米颗粒的形状和大小，并提高转化效率，使纳米颗粒能够大规模生产用于工业应用，特别是在飞机/汽车工业中。

The drive for miniaturization in electronics, photonics and biomedical device is spurring an ever growing need for micro/sub micro manufacturing. The research encompasses fundamental and applied research work with an industrial orientation to be able to make significant impact on MEMS and micro electronics industries. One of the major challenges in the area of MEMS and micro electronics lies in miniaturization and fabrication of these devices. Pulsed laser processing provides unique capability for producing features in micro/nano scale to industrial standard. The proposed research program defines a unique operating niche in micro/nanotechnology that cannot be fulfilled by other technologies. The technical expertise gained through this research would be unique and innovative with which new and improved products can be developed. The research work will focus on the following projects: 1) Micro and sub micro manufacturing. Study and develop an alternative technique for sub-micro manufacturing using short pulsed laser. Two fundamental manufacturing methods, effect of radially/tangentially polarised light and the concept of combination of laser ablation and wet etching for micro and submicro manufacturing will be studied in depth. From the study a macular model for high repetition rate laser ablation and managing rules for ultrashort laser oscillator micro/nano manufacturing will be developed 2) Microelectronics and MEMS applications. The fundamental investigations will be applied for thin wafer Dicing/Singulation with increased efficiency, improved quality, high die strength and lower kerfwidth. The other application is for IC Circuit failure analysis, by layer-by-layer removal in an IC circuit without damaging the underlying structures at high efficiency, quality and lower cost. 3) Nanoparticle generation by pulsed laser ablation. Nanoparticles can significantly improve the quality of products and enables new products. In this work we aim to study (Nano particle shape and size) and improve the converting efficiency, and enable mass production of nanoparticles for industrial applications, especially in the aircraft/automobile industry.