CSR---SMA: Thermal Modeling, Management, and Characterization of Chip Multiprocessors

不断增加的功率密度和冷却成本导致在早期设计阶段考虑芯片多处理器（CMP）设计的功率和热影响。该项目的目的是进行热建模和仿真的CMP，开发动态热管理（DTM）技术和执行热特性的设计。正在开发的热模型可以准确地捕捉处理器，片上网络和封装的热特性。DTM技术以处理器和网络协同为目标。大量的应用正在细晶粒和粗晶粒CMP上进行热特性分析。更广泛的影响将包括在网上提供工具，以帮助其他研究人员，将材料纳入研究生课程，让大学生参与研究，并向女生和少数民族学生推广。

Ever-increasing power densities and cooling costs have led to the consideration of the powerand thermal impact of chip multiprocessor (CMP) designs during early design stages. The aim of this project is to perform thermal modeling and simulation of CMPs, develop dynamic thermal management (DTM) techniques and perform thermal characterization of such designs. Thermal models being developed can accurately capture the thermal characteristics of the processors, on-chip network and packaging. The DTM techniques target the processors and network synergistically. A large suite of applications are being thermally characterized on bothfine-grain and coarse-grain CMPs. Broader impacts will include making the tools available on the web to help other researchers, inclusion of material in a graduate-level course, involvement of undergraduates in research and outreach to female and minority students.