IRES: Development of Global Scientists by Research Collaborations on Simulation and Optimization of Nanometer Integrated Systems

0623038 TanIRES：全球科学家的发展，通过研究合作，对模拟和优化的纳米集成systemsThis项目将支持两名本科生和一名研究生从加州大学滨江（UCR）混合信号纳米超大规模集成电路实验室每年夏天在未来三年进行联合研究，以解决设计和验证硅基纳米超大规模集成电路系统的挑战。 美国PI是UCR电气工程助理教授谢尔顿谭博士。 该项目的合作研究者是洪博士，他是北京清华大学设计自动化实验室的主任。IRES合作研究项目将重点关注高速电路的高效紧凑建模和快速仿真，同时考虑到纳米硅系统的制造和操作变化。 在联合教师的监督下，美国和中国学生将以团队形式共同开发新的终端和模型降阶技术以及用于电网设计的数值建模和统计谱分析的统计模拟和建模方法。IRES教育和研究活动为美国学生提供独特的培训，指导和智力发展机会。 学生，在他们的职业生涯早期，将受益于接触到国际公认的领导人在这一领域，这将使他们在未来更有能力的科学家和工程师。 联合研究的发现也将为课程的发展提供信息，并填补当前教科书中将数值建模作为一门学科的空白。

0623038TanIRES: Development of Global Scientists by Research Collaborations on Simulation and Optimization of Nanometer Integrated SystemsThis project will support two undergraduates and one graduate student from the University of California at Riverside (UCR) Mixed-Signal Nanometer VLSI Lab each summer over the next three years to conduct joint research to address challenges in designing and verifying silicon-based nanometer VLSI systems. The U.S. PI is Dr. Sheldon Tan, Assistant Professor in Electrical Engineering at UCR. The counterpart investigator is Dr. Hong, Xianlong Professor and Director of Tsinghua University's Design Automation Lab in Beijing, China. The IRES collaborative research projects to be conducted will focus on the efficient compact modeling and fast simulation of high-speed circuits taking into account manufacturing and operational variations in nanometer silicon systems. With joint faculty oversight, U.S. and Chinese students will work in teams to co-develop new terminal and model order reduction techniques and statistical simulation and modeling methods for numerical modeling and statistical spectral analysis applied to power grid design. The IRES educational and research activities provide unique training, mentoring and intellectual development opportunities for U.S. students. Students, early in their careers, will benefit from exposure to internationally recognized leaders in this field which will make them more competent scientists and engineers in the future. The discoveries from the joint research to be undertaken will also inform the development of curriculum and fill a gap in current textbook coverage of numerical modeling as a scholarly discipline.