SHF: Small: Collaborative Research: Design Automation for Block Copolymer Directed Self-Assembly (DSA) Lithography Patterning

SHF：小型：协作研究：嵌段共聚物定向自组装 (DSA) 光刻图案化的设计自动化

• 批准号: 1421563
• 负责人: Martin Wong
• 金额: $ 22.5万
• 依托单位: University of Illinois at Urbana-Champaign
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2014
• 资助国家: 美国
• 起止时间: 2014-09-01 至 2018-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1421563&HistoricalAwards=false
• 关键词: SHF; Small; Collaborative; Research; Design

Block-copolymer Directed Self-Assembly (DSA) lithography is a promising next-generation chip manufacturing technology which has the potential to produce chips with minimum feature size down to 7nm or below. The DSA technology has recently generated large excitements in the semiconductor industry. This project will undertake research efforts to address the challenges in developing complex computer software for the design automation of DSA-based chips so as to enable DSA as a viable approach for large-scale chip design of the future, and thus more complex chips may be produced at a much lower cost. Extensive student and PI exchange and visits throughout the program is expected to instill a broader intellectual perspective on the student education at both universities (Stanford and University of Illinois). The multidisciplinary and innovative nature of the proposed research will position the graduate and undergraduate students involved to launch successful careers in the area of chip manufacturing. To this end, the project has substantial emphasis on undergraduate research and education, including women and minorities. Due to the high throughput and low process cost of the DSA technology, it has become the most promising candidate patterning the uniform sized dense patterns (e.g. contacts, vias, cuts, etc.) for the next generation complementary lithography technology. The development and implementation of DSA technology require deep collaboration between process research and Electronic Design Automation (EDA) algorithm development. Since the DSA technology is very sensitive to the shapes and distributions of patterns, it is necessary for the EDA software to understand the patterning preferences of the DSA process, such that forbidden patterns will be disallowed and more preferred patterns will be used. The project proposes a co-optimization flow between DSA process research and EDA software development, and following the co-optimization flow, it proposes to develop DSA aware EDA software targeting the most urgent patterning problems for the DSA technology.

嵌段共聚物定向自组装(DSA)光刻是一种很有前途的新一代芯片制造技术，它有可能制造出最小特征尺寸小于或等于7 nm的芯片。DSA技术最近在半导体行业引起了巨大的轰动。这个项目将致力于研究如何解决开发复杂的计算机软件以实现基于DSA的芯片设计自动化的挑战，从而使DSA成为未来大规模芯片设计的可行方法，从而以更低的成本生产更复杂的芯片。在整个项目中，广泛的学生和PI交流和访问预计将为两所大学(斯坦福大学和伊利诺伊大学)的学生教育注入更广泛的知识视角。拟议研究的多学科和创新性质将使参与研究的研究生和本科生在芯片制造领域开始成功的职业生涯。为此，该项目非常重视本科生的研究和教育，包括妇女和少数群体。由于DSA技术的高产量和低工艺成本，它已经成为制作均匀尺寸的密集图案(例如触点、通孔、切割等)的最有前途的候选图案。用于下一代互补光刻技术。DSA技术的开发和实施需要工艺研究和电子设计自动化(EDA)算法开发之间的深度合作。由于DSA技术对图案的形状和分布非常敏感，因此EDA软件有必要了解DSA工艺的图案化偏好，以便禁用禁用的图案，并使用更多的首选图案。本项目提出了DSA工艺研究与EDA软件开发的协同优化流程，并根据协同优化流程，针对DSA技术中最迫切的模式化问题，开发了支持DSA的EDA软件。