SHF: Small: Research on New Challenges in EDA

SHF：小型：EDA 新挑战研究

• 批准号: 1017516
• 负责人: Martin Wong
• 金额: $ 35万
• 依托单位: University of Illinois at Urbana-Champaign
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2010
• 资助国家: 美国
• 起止时间: 2010-09-01 至 2014-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1017516&HistoricalAwards=false
• 关键词: SHF; Small; Research; New; Challenges

Micro-chips are at the heart of modern microelectronic systems for computing, communication, entertainment, and other consumer electronics. In order to design and manufacture next generations of complex microelectronic systems, major innovations in the design of EDA (electronic design automation) software are needed. This project addresses four new challenges in EDA for complex microelectronic systems at both the micro-chip and the circuit board levels: (1) Beyond-die EDA: The routing (wiring) of today?s high-density complex circuit boards has to be done manually since no existing EDA software can solve the problem. Research will be carried out in circuit board routing to handle various new technology issues. (2) Litho-aware EDA: Since there is no alternative practical option but to continue using 193nm light to print (manufacture) on-chip features of size 32nm and below, accurate printing has become extremely difficult. EDA software will be developed to produce designs that are friendly to lithography for successful micro-chip manufacturing. (3) GPU EDA: Graphics processing unit (GPU) has become a popular cost-effective parallel computing platform recently. How to take advantage of GPU to accelerate critical EDA tasks is a challenge and will be studied. (4) Stochastic EDA: In order to handle process variations in advanced technology nodes, EDA software will be designed to solve fundamental graph optimization problems (e.g., shortest path, minimum spanning tree, and network flow etc.) where edge weights (costs) are random variables. The proposed research will advance knowledge in EDA. It will also add new knowledge to other fields such as mathematical programming and combinatorial optimization since ultimately the research will need to solve large scale optimization problems. The broader impacts of this project include technology advancement and the education of next generation of engineers. The proposed research improves the design and manufacturing of microelectronic systems which will benefit the society at large. New research results will be passed on to undergraduate and graduate students through dissertation research, course projects, homework, and classroom teaching.

微芯片是用于计算、通信、娱乐和其他消费电子产品的现代微电子系统的核心。为了设计和制造下一代复杂的微电子系统，需要在EDA（电子设计自动化）软件的设计方面进行重大创新。本计画针对复杂微电子系统在微晶片与电路板层面的EDA所面临的四个新挑战：（1）超越晶粒的EDA：今天的布线（wiring）？由于现有的EDA软件无法解决这一问题，因此，高密度复杂电路板的设计必须由手工完成。将对电路板布线进行研究，以处理各种新技术问题。(2)光刻感知EDA：由于除了继续使用193 nm光来印刷（制造）尺寸为32 nm及以下的片上特征之外，没有其他可行的选择，因此精确印刷变得极其困难。将开发EDA软件，以产生对成功的微芯片制造的光刻友好的设计。(3)GPU EDA：图形处理器（GPU）已经成为一种流行的高性价比并行计算平台。如何利用GPU加速关键的EDA任务是一个挑战，将被研究。(4)随机EDA：为了处理先进技术节点中的工艺变化，EDA软件将被设计为解决基本图形优化问题（例如，最短路径、最小生成树、网络流等）其中边权重（成本）是随机变量。拟议的研究将推进EDA知识。它还将为其他领域增加新的知识，如数学规划和组合优化，因为最终研究将需要解决大规模优化问题。该项目的更广泛影响包括技术进步和下一代工程师的教育。拟议的研究改进了微电子系统的设计和制造，这将使整个社会受益。新的研究成果将通过论文研究，课程项目，家庭作业和课堂教学传递给本科生和研究生。