A STUDY OF ANALYSIS AND CONTROL OF SEMICONDUCTOR SURFACE REACTION BY SURFACE CARRIER CONDUCTION MODULATION

金属间隙半导体二极管结构的制备表明，可以通过观察表面态对载流子的捕获和发射来分析半导体表面悬空键的终止。研究表明，可以通过测量二极管结构的高频电容电压特性来评估半导体表面悬垂键的终止电平。对端氢硅和端氧硅金属间隙半导体二极管结构的高频电容电压测量表明，表面态密度反映了硅表面的工艺条件。此外，还确定了决定MOS器件性能的工艺。MOSFET器件的可靠性取决于栅极氧化物形成过程中温度上升期间生长在硅表面的预氧化物的质量。通过稀释预氧化物，可以制造高可靠性的MOSFET器件。金属（钨）-半导体（硅）触点的接触电阻取决于从清洗硅表面到金属膜沉积过程中在硅表面生长的天然氧化物的数量。通过抑制天然氧化物的生长，可以形成低电阻触点。

Metal-gap-semiconductor diode structures have been fabricated to demonstrate that the termination of dangling bonds at semiconductor surfaces can be analyzed by observing capture and emission of carriers by surface states. It has been demonstrated that the termination level of dangling bonds at semiconductor surfaces can be evaluated by measuring high-frequency capacitance-voltage characteristics of the diode structure. The high-frequency capacitance-voltage measurements of metal-gap-semiconductor diode structures with hydrogen-terminated and oxygen-terminated silicon surfaces indicate that the surface state density reflects process conditions of silicon surfaces. Furthermore, process determining MOS device performances have been ascertained. The reliability of MOSFET devices depends on the quality of the preoxide which is grown on the silicon surface during the temperature ramp-up in the gate oxide formation process. High reliable MOSFET devices can be fabricated by thinning the preoxide. The contac resistance of metal(tungsten)-semiconductor(silicon) contacts depends on the amount of native oxide grown on the silicon surface during from cleaning the silicon surface to the metal film deposition. The low resistance contacts can be formed by suppressing the native oxide growth.