LOW-TEMPERATURE GROWTH OF 3C-SIC FILMS ON SI SUBSTRATE

SI 衬底上 3C-SIC 薄膜的低温生长

• 批准号: 11450127
• 负责人: MIYASATO Tatsuro
• 金额: $ 4.48万
• 依托单位: KYUSHU INSTITUTE OF TECHNOLOGY
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 1999
• 资助国家: 日本
• 起止时间: 1999 至 2001
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-11450127/
• 关键词: silicon carbide; hydrogen plasma; sputtering; silicon substrate; low-temperature growth; stress; GeC buffer layer; interdiffusion; 界面ストレス; プラズマスパッタリング; 成長初期段階; 活性化エネルギー; 格子不整合; 3C-SiC薄膜; エピタキシャル成長; 内部応力; 初期段階; 欠陥; 成長メカニズム

The quality of the cubic silicon carbide (3C-SiC) grown on a Si substrate was very poor due to the large lattice mismatch of about 20 % between 3C-SiC and Si, the relatively large difference in thermal expansion coefficients of about 8 %, and the loss of the Si substrate at high growth temperatures above 1000℃. To help overcome these problems, a SiC buffer layer was prepared on the surface of a Si substrate by carbonization of the substrate and sputtering of a SiC target before the SiC growth. The SiC buffer layer prevented the loss of the substrate, but did not solve completely the problems of lattice mismatch and difference in thermal expansion coefficients between Si and SiC.Recently, the alloying of C with Si and Si_<1-x>Ge_x has attracted attention because of its ability to control the strain associated with the lattice mismatch to Si. There are large differences in covalent radius, bond length, and bond strength among C, Si and Ge. Therefore, it is possible to release the strains … More due to lattice mismatch at the SiC/Si interface by atomic self-organized interdiffusion if a Ge_<1-x>C_x layer is prepared before the SiC growth. For example, the diffusions of C into Si and Ge into SiC may result in the decrease in lattice mismatch between SiC and Si.In this project, we studied a new growth technique for 3C-SiC on a Si substrate. The Ge_<1-0.63>C_<0.63> buffer layer with a thickness of 5 nm was prepared on the Si substrate at 600℃, and was annealed at the same temperature in hydrogen atmosphere for 30 min. 3C-SiC can be grown on the substrate with the buffer layer at 850℃.The crystallinity of the 3C-SiC film depends strongly on the thickness of the buffer layer. The maximum X-ray diffraction intensity of the 3C-SiC film at a buffer thickness of about 5 nm is observed. The improved crystallinity of the SiC film is related to the release of the SiC/Si interface strains in the buffer layer during the growth of the SiC film.The effects of the Si(001) substrate on epitaxial growth of the SiC film are relaxed in the buffer layer. The SiC grains grow 'freely', that is, its growth is not affected by the Si substrate. The orientation of the SiC grains depends on free energies for nucleation and growth of the SiC grains. Therefore, the (111) oriented SiC grains are preferentially grown in the film because of smaller free energy of the (111)-oriented SiC nuclei at low temperature. Less

在Si衬底上生长的立方碳化硅(3C-SiC)的质量很差，这是由于3C-SiC与Si之间的晶格失配较大，约为20%，热膨胀系数相差较大，约为8%，以及在高于1000℃的高温下Si衬底的损耗。为了克服这些问题，在生长碳化硅之前，通过碳化和溅射碳化硅靶材，在硅衬底表面制备了碳化硅缓冲层。碳化硅缓冲层阻止了衬底的损失，但并没有完全解决晶格失配和硅与硅之间的热膨胀系数差异的问题。最近，C与硅和Si_(1-x)&Gt；Ge_x的合金化引起了人们的关注，因为它能够控制与Si晶格失配相关的应变。C、Si和Ge在共价半径、键长和键强等方面存在较大差异。因此，有可能释放菌株…如果在碳化硅生长之前制备了Ge_x；1-x&Gt；C_x层，则更多的原因是由于原子自组织互扩散导致的晶格失配。例如，C在Si中的扩散和Ge在SiC中的扩散可能会导致SiC和Si晶格失配的减少。在本项目中，我们研究了一种新的在Si衬底上生长3C-SiCe的技术。在600℃下，在硅衬底上制备了厚度为5 nm的Ge&lt；1-0.63&Gt；C&lt；0.63&gt；缓冲层，并在相同温度下氢气气氛中进行了30min的热处理。缓冲层温度为850℃时，可以在衬底上生长出3C-SiC薄膜，薄膜的结晶度强烈依赖于缓冲层的厚度。在缓冲层厚度约为5 nm时，观察到了3C-SiC膜的最大X射线衍射强度。碳化硅薄膜结晶度的提高与缓冲层中碳化硅/硅界面应变的释放有关，Si(001)衬底对碳化硅薄膜外延生长的影响在缓冲层中有所缓和。碳化硅颗粒自由生长，即不受硅衬底的影响。碳化硅颗粒的取向取决于碳化硅颗粒形核和长大的自由能。因此，由于低温下(111)取向的碳化硅晶核的自由能较小，因此(111)取向的碳化硅颗粒在薄膜中优先生长。较少

项目成果

Y.Sun,T.Miyasato et.al: "SAW Attenuation in C_<60> Thin Films at Transition Temperature"Physica B. 263/264. 766-768 (1999)

Y.Sun，T.Miyasato等人：“转变温度下C_60薄膜中的SAW衰减”Physica B.263/264。

Y.Sun,T.Miyasato: "Infrared Absorption Properties of Nanocrystalline Cubic SiC Films"Japanese Jaurnal of Applied Physics. 38. 5485-5489 (1999)

Y.Sun，T.Miyasato：“纳米晶立方SiC薄膜的红外吸收特性”日本应用物理学杂志。

Yong Sun,Tokihiro Ayabe and Tatsuro Miyasato: "Influence of SiC Cover Layer of Si Substrate on Properties of Cubic SiC Films Prepared by Hydrogen Plasma Sputtering"Japanese Journal of Applied Physics. 38. L714-L716 (1999)

Yong Sun、Tokihiro Ayabe 和 Tatsuro Miyasato：“Si 衬底的 SiC 覆盖层对氢等离子体溅射制备的立方 SiC 薄膜性能的影响”日本应用物理学杂志。

T. Takase, Y. Sun and T. Miyasato: "SAW Attenuation in C_<60> Thin Films at Transition Temperature"Physia B. 263-264. 766 (1999)

T. Takase、Y. Sun 和 T. Miyasato：“转变温度下 C_<60> 薄膜中的 SAW 衰减”Physia B. 263-264。

Y. Sun, T. Ayabe and T. Miyasato: "Influence of SiC Cover Layer of Si Substrate on Properties of Cubic SiC Films Prepared by Hydrogen Plasma Sputtering"Jpn. J. Appl. Phys.. 38-7A. L714 (1999)

Y. Sun、T. Ayabe 和 T. Miyasato：“Si 衬底的 SiC 覆盖层对氢等离子体溅射制备的立方 SiC 薄膜性能的影响”Jpn。