Three-dimensional imaging system using a varifocal mirror at video frame rate
Three-dimensional imaging system using a varifocal mirror at video frame rate
批准号:
14350137
负责人:
ISHII Akira
金额:
$8.58万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (B)
财政年份:
2002
资助国家:
日本
项目状态:
已结题
起止时间:
2002 至 2004
中文摘要
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英文摘要
Two types of imaging systems based on perfect projection using a varifocal mirror were devised to achieve high-quality three-dimensional imaging and precise measurement of shape. The first was a constant-magnification imaging system based on orthographic projection and the second was a wide-angle imaging system based on perspective projection. The first system using a piezoelectric-type varifocal mirror operating at an almost video-frame-rate of 20 Hz was used for an experimental setup for measuring an array of solder bumps on an LSI package board 10-mm square in size, on the edges of which 208 bumps with a diameter of 300 μm were arrayed at a pitch of 500 μm. Shape of an upper part of a solder bump could be acquired precisely. Height errors were less than 12 μm, so that precision was sufficient for automated inspection of solder bumps. Some horizontal sections of solder bumps have been estimated to have sufficient information. To obtain sectional data at a specified height, we set a pair of focal points, H1 and H2, with a specified interval along the height axis. By comparing the two images for focal points H1 and H2 with every pixel and selecting pixels with the same focus measure values, we can detect points on the contour of the section located at the mid-point between focal points H1 and H2. We assumed the solder bump was a sphere with a constant radius. By using the horizontal section at a specified height to fit a sphere into the bump, the height of the bump top was efficiently evaluated. Sphere fitting to estimate the bump height from the section could be successfully applied to measuring the coplanarity of a ball bump array. The time to measure an LSI package board was estimated to be 7.2s, using a personal computer.
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Akira Ishii: "Shape and height measurement of solder bumps using focus measure difference"Proc.SPIE. 5264. 241-248 (2003)
Akira Ishii:“使用焦点测量差值测量焊料凸块的形状和高度”Proc.SPIE。
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石井 明: "可変焦点ミラーを用いた三次元画像入力システムの試作"日本機械学会ロボティクス・メカトロニクス講演会'02講演論文集. 1A1-D02-(1)-1A1-D02-(2) (2002)
Akira Ishii:“使用可变焦镜的三维图像输入系统的原型”日本机械工程师学会机器人和机电一体化会议02论文集。
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发表时间:
2003
期刊:
Proc.SPIE 5202
影响因子:
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作者:
[Akira Ishii]
通讯作者:
Akira Ishii
球体または半球体の高さ計測方法
如何测量球体或半球的高度
DOI:
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发表时间:
2002
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石井 明: "可変焦点ミラーを用いた定倍率焦点調節機構の検討"日本機械学会ロボティクス・メカトロニクス講演会'02講演論文集. 1A1-D01(1)-1A1-D01(2) (2002)
Akira Ishii:“使用变焦镜的恒定放大倍率聚焦机构的研究”日本机械工程师学会机器人和机电一体化会议02论文集。
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共 23 条
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Neural correlates of mirror system of fatigue.
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he Health Model for Control of Myopia Progression of the Children
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Plaque visualization and hemodynamic analysis with magnetic resonance imaging in swine carotid atherosclerosis model
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Design and Development of semiconductor-supported catalyst for save and recycle of rare elements for catalysis
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Molecular mechanisms of cytoldne-mediated basophil activation.
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Reevaluation of Sino-Soviet Confrontation
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