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Three-dimensional imaging system using a varifocal mirror at video frame rate

Three-dimensional imaging system using a varifocal mirror at video frame rate
在视频帧速率下使用变焦镜的三维成像系统
批准号:
14350137
负责人:
ISHII Akira
金额:
$8.58万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (B)
财政年份:
2002
资助国家:
日本
项目状态:
已结题
起止时间:
2002 至 2004

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中文摘要
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英文摘要
Two types of imaging systems based on perfect projection using a varifocal mirror were devised to achieve high-quality three-dimensional imaging and precise measurement of shape. The first was a constant-magnification imaging system based on orthographic projection and the second was a wide-angle imaging system based on perspective projection. The first system using a piezoelectric-type varifocal mirror operating at an almost video-frame-rate of 20 Hz was used for an experimental setup for measuring an array of solder bumps on an LSI package board 10-mm square in size, on the edges of which 208 bumps with a diameter of 300 μm were arrayed at a pitch of 500 μm. Shape of an upper part of a solder bump could be acquired precisely. Height errors were less than 12 μm, so that precision was sufficient for automated inspection of solder bumps. Some horizontal sections of solder bumps have been estimated to have sufficient information. To obtain sectional data at a specified height, we set a pair of focal points, H1 and H2, with a specified interval along the height axis. By comparing the two images for focal points H1 and H2 with every pixel and selecting pixels with the same focus measure values, we can detect points on the contour of the section located at the mid-point between focal points H1 and H2. We assumed the solder bump was a sphere with a constant radius. By using the horizontal section at a specified height to fit a sphere into the bump, the height of the bump top was efficiently evaluated. Sphere fitting to estimate the bump height from the section could be successfully applied to measuring the coplanarity of a ball bump array. The time to measure an LSI package board was estimated to be 7.2s, using a personal computer.
期刊论文(51)
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会议论文
Akira Ishii: "Shape and height measurement of solder bumps using focus measure difference"Proc.SPIE. 5264. 241-248 (2003)
Akira Ishii:“使用焦点测量差值测量焊料凸块的形状和高度”Proc.SPIE。
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作者: []
通讯作者:
石井 明: "可変焦点ミラーを用いた三次元画像入力システムの試作"日本機械学会ロボティクス・メカトロニクス講演会'02講演論文集. 1A1-D02-(1)-1A1-D02-(2) (2002)
Akira Ishii:“使用可变焦镜的三维图像输入系统的原型”日本机械工程师学会机器人和机电一体化会议02论文集。
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DOI: --
发表时间: 2003
期刊: Proc.SPIE 5202
影响因子: --
作者: [Akira Ishii]
通讯作者: Akira Ishii
DOI: --
发表时间: 2004
期刊: Proc.17th ICPR 3
影响因子: --
作者: [Kouji Murakami, Tsutomu Hasegawa, Akira Ishii]
通讯作者: Akira Ishii
23
    Research on the McKay correspondence and derived categories
    • 批准号:
      24540041
    • 项目类别:
      Grant-in-Aid for Scientific Research (C)
    • 资助金额:
      $3.24万
    • 财政年份:
      2012
    • 负责人:
      ISHII Akira
    • 依托单位:
    Design and development of supported catalysts due to computational physics and experiments for save and reuse of rare elements for catalyst
    • 批准号:
      23246013
    • 项目类别:
      Grant-in-Aid for Scientific Research (A)
    • 资助金额:
      $31.87万
    • 财政年份:
      2011
    • 负责人:
      ISHII Akira
    • 依托单位:
    Application of Fourier transformation-linear ion trap mass spectrometers to forensic medicine
    • 批准号:
      23390183
    • 项目类别:
      Grant-in-Aid for Scientific Research (B)
    • 资助金额:
      $10.32万
    • 财政年份:
      2011
    • 负责人:
      ISHII Akira
    • 依托单位:
    Neural correlates of mirror system of fatigue.
    • 批准号:
      23700804
    • 项目类别:
      Grant-in-Aid for Young Scientists (B)
    • 资助金额:
      $2.75万
    • 财政年份:
      2011
    • 负责人:
      ISHII Akira
    • 依托单位:
    海外基金