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Basic Research of UltraーHigh-Speed ThreeーTerminal Electronic Device Using Metal-Insulator Superlattice

Basic Research of UltraーHigh-Speed ThreeーTerminal Electronic Device Using Metal-Insulator Superlattice
利用金属-绝缘体超晶格的超高速三端电子器件基础研究
批准号:
63420035
负责人:
ASADA Masahiro
金额:
$29.76万
依托单位国家:
日本
项目类别:
Grant-in-Aid for General Scientific Research (A)
财政年份:
1988
资助国家:
日本
项目状态:
已结题
起止时间:
1988 至 1990

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中文摘要
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英文摘要
This project is a basic research for realization of three-terminal ultra-highーspeed electronic device using metalーinsulator superlattice and multilayer structures. The main purpose is realization of epitaxial growth of metal-insulator superlattice and ultraーthin layers, establishment of the theory on material properties of this superlattice, and clarification of the basic properties of devices using this material system. Results obtained are summarized as follows.For highーspeed electronic devices, a novel transistor, which introduces metalーinsulator heterostructure and the quantum interference of highーvelocity hot electrons in conduction band of an insulator, was proposed. Possibility of high speed response close to THz of this device was theoretically shown. Also, theoretical analysis was made for the electronic band structure of metal insulator superlattice.Crystal growth of metalーinsulator superlattice and ultraーthin layers was investigated using the ionized cluster beam technique. We chose CaF_2 for the insulator and CoSi_2 for the metal, both of which are lattice matched relatively well to silicon substrate. Condition of epitaxial growth of singleーcrystal flat thin layer (-nm thick) of CoSi_2 on CaF_2/Si(111) was made clear. Using this condition, we fabricated metalーinsulator superlattice.Selective wet chemical etching process necessary to the fabrication of threeーterminal devices with metalーinsulator multilayer structure was found. Using this process, we fabricated the device structure for resistivity measurement of nanometerーthick metal layers in a metalーinsulator multilayer structure, and resistivity of 70 mu OMEGA cm was obtained for ultrathin (2nm thick) CoSi_2 layer. This result shows possibility of ultraーhigh speed device with this material combination.By these results, we obtained possibility of ultraーhighーspeed electronic devices using metalーinsulator multilayer structures and basic knowledge essential to the realization of these devices.
期刊论文(18)
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会议论文
坂口 知明: "金属・絶縁体ヘテロ構造を用いた量子効果超高速電子デバイスの解析" 電子情報通信学会全国大会(秋). C-410 (1990)
Tomoaki Sakaguchi:“使用金属绝缘体异质结构的量子效应超快电子器件分析”IEICE 全国会议(秋季)(1990 年)。
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通讯作者:
H. Muguruma: "Energy Band Structure of Metal Japan (Semiconductor)-Insulator Superlattice" Nat. Conv. Rec.IEICE of C-545. (Marc)
H. Muguruma:“金属日本(半导体)-绝缘体超晶格的能带结构”Nat。
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通讯作者:
T. Sakaguchi: "Analysis of QuantumーSizeーEffect Japan HighーSpeed Electron Devices Using MetalーInsulator Heterostructure" Nac. Conv. Rec.IEICE of C-410. (Oct.)
T. Sakaguchi:“使用金属-绝缘体异质结构的日本高速电子器件的分析”Rec.IEICE of C-410(10 月)
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通讯作者:
V.Chaki: Trans.IEICE of Japan.
V.Chaki:日本Trans.IEICE。
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通讯作者:
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