Mechanism of Wear of Semiconductors and Ceramics

晶体半导体和陶瓷的摩擦学是 这对这些材料在高科技中的应用至关重要 应用. 例如，半导体用于大规模 集成电路由金刚石浸渍轮切割， 在含有磨料颗粒的流体中研磨和抛光。 陶瓷被用作耐磨涂层， 往复式发动机和其他机器， 以相对速度移动，使得陶瓷涂层 由于这些表面的无意接触而磨损。 的 研磨颗粒与晶体半导体的接触 或陶瓷会损坏这些材料的表面。 这种损害 是有害的，因为它会产生裂缝， 灾难性脆性破坏 目前没有定量 可以预测这种损害的模式或程度的模型。 这 项目开发了一个独特的模型，简单明了， 摩擦学实验，可用于确定和 最终预测了晶体的变形机制 半导体和陶瓷。 这项研究的结果将 对工业是有价值的并且可用于优化切割， 研磨和抛光晶体半导体， 陶瓷涂层的磨料磨损。

The Tribology of crystalline semiconductors and ceramics is critical to the utilization of these materials in high technology applications. For example, semiconductors used for large-scale integrated circuits are cut by diamond impregnated wheels and, lapped and polished in fluids that contain abrasive particles. Ceramics are being used as abrasion resistant coatings in reciprocating engines and other machines where surfaces are moving at a relative velocity so that the ceramic coating is abraded due to inadvertent contact of these surfaces. The contact of an abrasive particle with a crystalline semiconductor or ceramic damages the surfaces of these materials. This damage is detrimental because it creates cracks which can lead to catastrophic brittle failure. There is currently no quantitative model which can predict the mode or extent of this damage. This project develops a unique model and, simple and straightforward tribological experiments that can be used to determine and eventually predict the deformation mechanisms of crystalline semiconductors and ceramics. The results of this research will be valuable to industry and may be utilized to optimize cutting, lapping and polishing crystalline semiconductors and minimize the abrasive wear of ceramic coatings.