IRES: Development of Global Scientists by Research Collaborations on Simulation and Optimization of Nanometer Integrated Systems

0623038TanIRES：通过纳米集成系统仿真和优化研究合作促进全球科学家的发展该项目将在未来三年内每年夏天支持加州大学河滨分校（UCR）混合信号纳米VLSI实验室的两名本科生和一名研究生进行联合研究，以解决设计和验证硅基纳米VLSI系统的挑战。美国PI是加州大学r分校电子工程助理教授Sheldon Tan博士。对口研究者是中国北京清华大学设计自动化实验室主任洪贤龙教授。将进行的IRES合作研究项目将侧重于考虑纳米硅系统的制造和操作变化的高速电路的高效紧凑建模和快速仿真。在教师的共同监督下，美国和中国学生将组成团队，共同开发新的终端和模型降阶技术，以及用于电网设计的数值建模和统计频谱分析的统计模拟和建模方法。IRES的教育和研究活动为美国学生提供独特的培训、指导和智力发展机会。学生在职业生涯早期将受益于接触该领域国际公认的领导者，这将使他们在未来成为更有能力的科学家和工程师。将进行的联合研究的发现也将为课程的发展提供信息，并填补目前教科书中数值建模作为一门学术学科的空白。

0623038TanIRES: Development of Global Scientists by Research Collaborations on Simulation and Optimization of Nanometer Integrated SystemsThis project will support two undergraduates and one graduate student from the University of California at Riverside (UCR) Mixed-Signal Nanometer VLSI Lab each summer over the next three years to conduct joint research to address challenges in designing and verifying silicon-based nanometer VLSI systems. The U.S. PI is Dr. Sheldon Tan, Assistant Professor in Electrical Engineering at UCR. The counterpart investigator is Dr. Hong, Xianlong Professor and Director of Tsinghua University's Design Automation Lab in Beijing, China. The IRES collaborative research projects to be conducted will focus on the efficient compact modeling and fast simulation of high-speed circuits taking into account manufacturing and operational variations in nanometer silicon systems. With joint faculty oversight, U.S. and Chinese students will work in teams to co-develop new terminal and model order reduction techniques and statistical simulation and modeling methods for numerical modeling and statistical spectral analysis applied to power grid design. The IRES educational and research activities provide unique training, mentoring and intellectual development opportunities for U.S. students. Students, early in their careers, will benefit from exposure to internationally recognized leaders in this field which will make them more competent scientists and engineers in the future. The discoveries from the joint research to be undertaken will also inform the development of curriculum and fill a gap in current textbook coverage of numerical modeling as a scholarly discipline.