New Method for Room Temperature Bonding at Ambient Gas

本研究的目的是建立一种在环境气体中进行室温键合的方法，为利用日本先进的表面活化键合方法实现器件的工业化和批量生产提供一种新的途径，为此，系统地积累和整理了键合及其机理的基础知识。在此基础上，提出了Ar离子轰击、Si纳米粘附层、原子扩散连接、空气等离子体处理、氢辐射处理以及它们的组合等新工艺，验证了室温连接方法的可行性。在研究过程中，还完成了一项新的发现，表明使用Si-Fe纳米粘附层粘合聚合物，玻璃和SiC的可能性，这在最初的研究提案中没有计划。最后，它已被证明，所提出的工艺可以成功地应用于集成光学微系统和密封微器件。

This research aims to establish a method for room temperature bonding in ambient gas as a new approach to industrial and volume production for devices using the surface activated bonding method which has been developed in advance in Japan.For thie purpose, the fundamental knowledge for bonding and it mechanism was accumulated and compiled systematically. Based on those research results, new processes including Ar-ion bombardment, Si-nano adhesion layer, atom diffusion bonding, air-plasma treatment, hydrogen radiacal treatment, and their combined process were proposed to demostrate the feasibility of the method for room temperature bonding. During the research also a new finding was done that shows the possibility of bonding polymers, glasses, and SiC using Si-Fe nano-adhesion layer, which was not planned in the original research proposal. Finally it has been shown that the proposed process can be applied successfully to integrating optical microsystems and sealing micro-devices.