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Atomic Layer Deposition of Metal Nitride and Oxide Thin Films

Atomic Layer Deposition of Metal Nitride and Oxide Thin Films
金属氮化物和氧化物薄膜的原子层沉积
批准号:
0314615
负责人:
Charles Winter
金额:
$36.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2003
资助国家:
美国
项目状态:
已结题
起止时间:
2003-08-01 至 2007-07-31

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中文摘要
翻译
无机化学、生物无机化学和金属有机化学项目的这一奖项支持韦恩州立大学的Charles H.温特博士的研究,该研究旨在开发和评估通过原子层沉积和相关的逐层薄膜生长技术生长薄金属氮化物和氧化物薄膜的前体。随着微电子工业向越来越小的尺寸发展,传统材料可能不再在未来的设备中提供所需的特性。本研究旨在通过对挥发性金属钽配合物和钨(VI)配合物的合成、结构和性能的研究,制备新型金属氮化物阻挡材料(TaN、WNx)和新型金属氧化物绝缘体薄膜。这些化合物中的替代物将被操纵,以实现对氨、肼衍生物和其他氮源化合物的热稳定性和反应性,这是氮化物原子层沉积薄膜生长所需的。还将探索挥发性的锆化物、半胺化合物和稀土金属酰胺化合物,以实现对水、氧、臭氧和其他源化合物的热稳定性和反应性,这是氧化物原子层沉积薄膜生长所需的。来自沉积实验的信息将被用来设计改进的第二代和第三代前驱体,使材料性能最大化。这项研究的成功实施导致了一系列优化的原子层沉积前驱体,以提供重要类型的金属氮化物和氧化物薄膜。用原子层沉积技术生长非常薄的氮化物阻挡层材料和高介电氧化层是保持微电子器件未来小型化步伐必须解决的核心挑战。拟议研究的一个主要特点是与赫尔辛基大学的尼尼斯托教授合作进行原子层沉积薄膜生长研究。拟议的合成无机基团和薄膜生长基团的配对将加速原子层沉积前体和薄膜生长程序的开发。学生将受益于在包括合成无机化学、电影生长和表征、国际经验和工业实习在内的跨学科环境中工作。拟议的研究范围需要发展优秀的沟通技能,才能在学术、工业和国际环境中蓬勃发展。学生将体验到多样化的教育环境,并将拥有非常广泛的科学技能和视角,这将为他们的独立职业生涯做好准备。
英文摘要
This award in the Inorganic, Bioinorganic and Organometallic Chemistry program supports research by Dr. Charles H. Winter at Wayne State University to develop and evaluate precursors for the growth of thin metal nitride and oxide films by Atomic Layer Deposition and related layer-by-layer film growth techniques. As the microelectronics industry moves to progressively smaller sizes, traditional materials may no longer provide the required properties in future devices. This research aims at producing thin films of new metal nitride barrier materials (TaN, WNx) and new metal oxide insulators through the study of volatile tantalum complexes and the synthesis, structure, and properties of tungsten(VI) complexes. Substitutents in these compounds will be manipulated to achieve the thermal stability and reactivity toward ammonia, hydrazine derivatives, and other nitrogen source compounds required for nitride Atomic Layer Deposition film growth. Volatile zirconium, halfnium and lanthanide metal amidinate compounds will also be explored to achieve the thermal stability and reactivity toward water, oxygen, ozone, and other source compounds required for oxide Atomic Layer Deposition film growth. Information from the deposition experiments will be used to design improved second and third generation precursors that maximize materials properties.Successful execution of this research leads toward a range of optimized Atomic Layer Deposition precursors to provide important types of metal nitride and oxide thin films. The growth of very thin layers of nitride barrier materials and high dielectric oxides by Atomic Layer Deposition techniques is a central challenge that must be solved to maintain the pace of future miniaturization in microelectronics devices. A central feature of the proposed research is the collaboration with Professor Niinisto at the University of Helsinki to perform Atomic Layer Deposition film growth studies. The proposed pairing of synthetic inorganic and film growth groups will accelerate the development of Atomic Layer Deposition precursors and film growth procedures. Students will benefit from working in an interdisciplinary environment that includes synthetic inorganic chemistry, film growth and characterization, international experience, and industrial internships. The scope of the proposed research requires the development of excellent communication skills to prosper in academic, industrial, and international settings. The students will experience a diverse educational environment, and will emerge with very broad scientific skills and perspective that will prepare them well for their independent careers.
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  • 资助金额:
    $45.0万
  • 财政年份:
    2009
  • 负责人:
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