Ultrafine/High-speed electron devices based on buried nano-metal-wires in compound semiconductors

基于化合物半导体中埋入式纳米金属线的超细/高速电子器件

基本信息

  • 批准号:
    14350182
  • 负责人:
  • 金额:
    $ 9.66万
  • 依托单位:
  • 依托单位国家:
    日本
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
  • 财政年份:
    2002
  • 资助国家:
    日本
  • 起止时间:
    2002 至 2003
  • 项目状态:
    已结题

项目摘要

Our researches consisted of following two terms.1.Emitter structure for extraction of electrons by buried nano-metal-wires as gateWe fabricated hot electron transistors with buried nano-metal -wires to extract ion of electron. In DC characteristics, saturated I-V characteristics was confirmed.To suppress current injection from emitter to gate, new structure was invented (patent applied for) and ratio between emitter current vs. gate current was enhanced to several tens. Estimated transconductance was 10 mS from obserbed DC charactarisrtics.To reduce scattering of electron, purity of InP intrinsic layer was confirmed. As a result, electron mobility of 110,000 cm^2/Vs at 77 K was confirmed in AlInAs/InP HEMT structure, When Si-doped layer was eliminated, electron mobility of 220,000 cm^2/Vs at 77K was confirmed. To our knowledge, these mobility at 77K was world records. Thus high purity of our materials was confirmed.2.Collector structure by buried nano-metal-wire.Through study through crystal growth, we found that thickness of over layer on wires was changed by the number of wires. Because failure of crystal growth was due to this phenomena, we fabricated the structure with only one wire as a collector with refinement of crystal growth conditions. As a result, we fabricated HBT with one nano^metal wire as collector. In this device, the emitter area was 0.1μm×0.5μm. To our knowledge, this area was smallest as heterojunction bipolar transistors. Smallest total collector capacitance was also confirmed.As a contact resistance, emitter contact resistivity was reduced from 3x10^<-6>Wcm^2 to 1x10^<-6>Wcm^2 and base contact resistivity was reduced from 2.5x10^<-6>Wcm^2 to 3x10^<-7>Wcm^2 by change of electrode material (from titanium to pallsdium). This reduction combined with small collector capacitance is very important to obtain good microwave performance.
本论文的研究工作主要包括以下两个方面:1.埋层纳米金属线作为栅极的电子引出结构我们制作了埋层纳米金属线作为栅极的电子引出结构的热电子晶体管,在直流特性方面,证实了饱和的I-V特性,为了抑制从发射极到栅极的电流注入,发明了新的结构(已申请专利),并且发射极电流与栅极电流之间的比率提高到几十。从测试的直流特性估算出InP本征值为10 mS,为了减少电子的散射,确定了InP本征层的纯度。结果,在AlInAs/InP HEMT结构中确认了77 K下的110,000 cm ^2/Vs的电子迁移率。当去除Si掺杂层时,确认了77 K下的220,000 cm ^2/Vs的电子迁移率。据我们所知,77 K的流动性是世界纪录。2.埋层纳米金属线集电体结构通过晶体生长研究,发现金属线上覆盖层的厚度随金属线的数目而变化。由于晶体生长的失败是由于这种现象,我们制造的结构,只有一个线作为集电极与细化的晶体生长条件。因此,我们制作了一个纳米金属线作为收集极的HBT。该器件的发射极面积为0.1μm×0.5μm。据我们所知,这个面积是最小的异质结双极晶体管。作为接触电阻,通过改变电极材料(从钛到钯),发射极接触电阻率从3 × 10 <-6>^Wcm ^2降低到1 × 10 ^<-6>Wcm ^2,基极接触电阻率从2.5 × 10 <-6>^Wcm ^2降低到3 × 10 ^<-7>Wcm ^2。这种减小与小的集电极电容相结合对于获得良好的微波性能是非常重要的。

项目成果

期刊论文数量(66)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Keigo Yokoyama: "Fabrication of GaInAs/InP heterojunction bipolar transistors with a single tungsten wire as collector electrode"Jpn.J.Appl.Phys.. 42・12B. L1051-L1503 (2003)
Keigo Yokoyama:“用单根钨丝作为集电极电极的 GaInAs/InP 异质结双极晶体管的制造”Jpn.J.Appl.Phys.. 42・12B (2003)。
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    0
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K.Takeuchi: "InP hot electron transistors using modulation of gate electrodes"The 2003 International Conference on Solid State Devices and Materials. E-7-3. (2003)
K.Takeuchi:“使用栅电极调制的 InP 热电子晶体管”2003 年国际固态器件和材料会议。
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    0
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  • 通讯作者:
K.Yokoyama: "Wet etching for self-aligned 0.1-mm-wide emitter in InP/InGaAs HBT"Topical Workshop on Heterostructure Microelectronics (TWHM'03). W-11. (2003)
K.Yokoyama:“InP/InGaAs HBT 中自对准 0.1 毫米宽发射极的湿法蚀刻”异质结构微电子专题研讨会 (TWHM03)。
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  • 影响因子:
    0
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  • 通讯作者:
Y.Miyamoto: "InP Hot Electron Transistor with a Buried Metallic Gate for Electron Emission"60th Annual Device Research Conference. III-20. (2002)
Y.Miyamoto:“具有用于电子发射的埋入金属栅极的 InP 热电子晶体管”第 60 届年度器件研究会议。
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  • 影响因子:
    0
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  • 通讯作者:
R.Nakagawa: "InP Hot Electron Transistors with Reduced Emitter Width for Controllability of Collector Current by Gate Bias"International Conference on Indium Phosphide and Related Materials. P1-14. (2004)
R.Nakakawa:“InP热电子晶体管,具有减小的发射极宽度,可通过栅极偏置控制集电极电流”,磷化铟及相关材料国际会议。
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    0
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MIYAMOTO Yasuyuki其他文献

Simulation of the Short Channel Effect in GaN HEMT with a Combined Thin Undoped Channel and Semi-Insulating Layer
结合薄未掺杂沟道和半绝缘层的 GaN HEMT 中的短沟道效应仿真
  • DOI:
    10.1587/transele.2019fus0002
  • 发表时间:
    2020
  • 期刊:
  • 影响因子:
    0.5
  • 作者:
    MIYAMOTO Yasuyuki;GOTOW Takahiro
  • 通讯作者:
    GOTOW Takahiro
Vacuum Annealing and Passivation of HfS<sub>2</sub> FET for Mitigation of Atmospheric Degradation
HfS<sub>2</sub> FET 的真空退火和钝化缓解大气退化
  • DOI:
    10.1587/transele.e100.c.453
  • 发表时间:
    2017
  • 期刊:
  • 影响因子:
    0.5
  • 作者:
    UPADHYAYA Vikrant;KANAZAWA Toru;MIYAMOTO Yasuyuki
  • 通讯作者:
    MIYAMOTO Yasuyuki

MIYAMOTO Yasuyuki的其他文献

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{{ truncateString('MIYAMOTO Yasuyuki', 18)}}的其他基金

Complementary vertical tunnel FET aiming for low voltage and high speed operation by heterostructure design and miniaturization
通过异质结构设计和小型化实现低电压和高速运行的互补垂直隧道 FET
  • 批准号:
    26249046
  • 财政年份:
    2014
  • 资助金额:
    $ 9.66万
  • 项目类别:
    Grant-in-Aid for Scientific Research (A)
Research on vertical InP-related hot electron transistors with insulated gate
垂直InP型绝缘栅热电子晶体管研究
  • 批准号:
    19206038
  • 财政年份:
    2007
  • 资助金额:
    $ 9.66万
  • 项目类别:
    Grant-in-Aid for Scientific Research (A)
Research for ultra-fast operation of InP HBT by ballistic transportation in collector
InP HBT在收集器中弹道输运超快运行研究
  • 批准号:
    16360170
  • 财政年份:
    2004
  • 资助金额:
    $ 9.66万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
Improving Crystal Conditions of Compound Semiconductors Laterally Grown on Metal Wire
改善金属线上横向生长的化合物半导体的晶体条件
  • 批准号:
    11450006
  • 财政年份:
    1999
  • 资助金额:
    $ 9.66万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
Ultra High-Speed Operation of Ultra-Fine GaInAs/InP HBT by Suppressing Recombination Current at Mesa Sidewall
通过抑制台面侧壁复合电流实现超细 GaInAs/InP HBT 的超高速运行
  • 批准号:
    11555092
  • 财政年份:
    1999
  • 资助金额:
    $ 9.66万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)

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太赫兹 SiGeC 异质结双极晶体管的基本挑战和潜在解决方案
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    242702231
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  • 批准号:
    0512723
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未来无线片上系统 (SoC) 的 SiGe 功率异质结双极晶体管的性能限制
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超高速 InP/GaAsSb/InP 双异质结双极晶体管的设计、制造和表征
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