Quantitative Evaluation of Pinehole Defects in Corrosion-Resistant Thin Films Prepared by Dry Coating Process

干法涂覆耐腐蚀薄膜中针孔缺陷的定量评价

• 批准号: 06303006
• 负责人: SUGIMOTO Katsuhisa
• 金额: $ 2.69万
• 依托单位: TOHOKU UNIVERSITY
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Co-operative Research (A)
• 财政年份: 1994
• 资助国家: 日本
• 起止时间: 1994 至 1995
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-06303006/
• 关键词: Dry coating; TiN; Critical passivation current density method; Pinhole defect; Anodic polarization curve; Stainless steel; ドライコーティング; 臨界不働態化電流密度

Critical passivation current density (CPCD) method has been applied to the defect evaluation on TiN-coated SUS304 stainless steels. Thin TiN films 0.5-4.0mum thick were prepared by several kinds of dry coating processes including hollow cathode discharge ion plating, plasma enhanced chemical vapor deposition, dynamic mixing, cathode are discharge ion plating, and activated reactive evaporation. To obtain quantitative relationships between the area fraction of pinhole defects and the thickness of TiN films, the measurement conditions of CPCD were optimized for TiN-coated SUS304 stainless steels. The optimum polarization conditions thus determined are summerized as follows ;Solution : deaerated 0.5M-H_2SO_4+0.05M-KSCN at 298K,Potential range : -0.45 to 0.40 V (vs. Ag/AgCl, 3.33M-KCl),Scan rate : 0.3 to 0.4 m V・s^<-1>.It was found that the area fraction, R_i, of pinhole defects in the TiN films decreased with increasing the thickness of the films, d_<TiN>, and became almost constant when the value of d_<TiN> exceeded 2.5mum. The amount of pinehole defects depends also on the preparation method of TiN films. The TiN film 4.0mum thick, which was formed by activated reactive evaporation, showed the lowest value of R_i.

将临界钝化电流密度(CPCD)法应用于TiN涂层SUS304不锈钢的缺陷评定。采用中空阴极放电离子镀、等离子体增强化学气相沉积、动态混合、阴极弧光放电离子镀、活化反应蒸发等几种干法镀膜工艺制备了厚度为0.5~4.0微米的TiN薄膜。为了得到针孔缺陷面积分数与TiN膜厚度之间的定量关系，对TiN涂层SUS304不锈钢的CPCD测量条件进行了优化。确定的最佳极化条件为：溶液：298K下脱气0.5M-H_2SO_4+0.05M-KSCN，电位范围：-0.45~0.40V(vs.Ag/AgCl，3.33M-KCl)，扫描速度：0.3~0.4mV·S；Tin&gt；超过2.5微米。松孔缺陷的数量还取决于TiN薄膜的制备方法。活化反应蒸发形成的TiN薄膜厚度为4.0微米，其RI值最低。

项目成果

内田 仁: "TiN被覆ステンレス鋼におけるピンホール欠陥の電気化学的評価" 材料と環境. 44. 350-354 (1995)

Hitoshi Uchida：“TiN 涂层不锈钢针孔缺陷的电化学评估”材料与环境。44. 350-354 (1995)。

Katsuhisa Sugimoto: "The State of the Art of Defects Evaluation on Corrosion-Resistant Thin Films Prepared by Dry Coating Process" Zairyo-to-Kankyo. 44. 308-313 (1995)

Katsuhisa Sugimoto：“干式涂层工艺制备的耐腐蚀薄膜缺陷评估的最新技术”Zairyo-to-Kankyo。

杉本 克久: "耐食性ドライコーティング膜の欠陥評価の現状" 材料と環境. 44. 308-313 (1995)

Katsuhisa Sugimoto：“耐腐蚀干涂膜缺陷评估的现状”《材料与环境》，44. 308-313 (1995)。

Hitoshi Uchida et al.: "Electrochemical Evaluation of Pinhole Defects in TiN-Coated Stainless Steels" Zairyo-to-Kankyo. 44. 350-354 (1995)

Hitoshi Uchida 等人：“TiN 涂层不锈钢中针孔缺陷的电化学评估”Zairyo-to-Kankyo。