GOALI: Wafer-Level and Chip-Scale Packaging (WL-CSP) of MEMS

本研究的目的是设计、开发和测试一种用于微电子机械系统封装的新型晶圆级封装和芯片级互连方案。选择硅片上的射频微机电系统开关器件阵列作为演示试验台。其目标是实现和测试高阻硅、聚合物和低温共烧陶瓷晶片的封顶，以及用于封装和互连设备晶片上的射频微机电系统开关的贯穿晶片金属化过孔。该项目将在阿肯色大学、威斯普里大学和桑迪亚国家实验室之间的持续合作中实施。拟议的技术方法的成功将使该行业能够在密闭环境中工作的微型机电系统设备的广泛范围内工作。这些发展有利于电信、国土安全、生物医疗设备、汽车和航空航天传感器、薄型显示器和固态照明应用以及燃料电池等战略应用领域的微型机电系统封装。该小组的跨学科专业知识将有助于对参与该项目的学生进行微系统教育。在这项研究中，将特别强调在代表性不足的少数群体中招聘和培养教学、培训和学习。调查人员将继续与地区学校社区建立持续的伙伴关系，并将利用这些经验与地区社区学院建立新的关系。如今，培训是不可避免的，尤其是对中西部的科技界来说，在美国创造和保留新的高薪微系统相关工作岗位是不可避免的。

The objective of this research is to design, develop and test a novel wafer-level encapsulation and chip-scale interconnection scheme for packaging of micro electromechanical systems. Arrays of radio frequency micro electromechanical system switch devices on a wafer are chosen as a demonstration test bed. The goal is to implement and test capping high resistivity silicon, polymer and low temperature co-fired ceramic wafers, with through wafer metallized vias for encapsulation and interconnection of radio frequency micro electromechanical system switches on the device wafer. This project will be executed in an ongoing collaboration among the University of Arkansas, wiSpry, and Sandia National Laboratories. The success of the proposed technical approach will allow the industry to work on a wide gamut of micro electromechanical system devices operational in hermetic environments. These developments benefit micro electromechanical system packaging in strategic application areas of telecommunication, homeland security, biomedical devices, automotive and aerospace sensors, thin display and solid state lighting applications and fuel cells. The interdisciplinary expertise of the team will be conducive for the microsystems education of the students involved on this project. In the research, the special emphasis will be to recruit and nurture teaching, training and learning within underrepresented minorities. Investigators will continue to build their ongoing partnership with area school community and the experience will used to forge new relations with the area Community Colleges. Training is inevitable today- to the technology community particularly in the Midwest- to create and retain new high paid microsystems related jobs in America.