Relationship Between Slurry Actions in Slicing Grooves and Slicing Characteristics at Multi-Wire Saw to slice semiconductor materials

多线锯是加工大尺寸硅锭的方法之一。这种切片方法使用混合磨料颗粒的工作流体，称为浆料。在工件下降型的多线锯的情况下，这种浆料被提供在线上并被带到加工区域。由于加工过程中会有浆液进入线材与工件之间，浆液的作用对硅片的切片效率和精度至关重要。在本研究中，通过高速摄像机观察了浆料在线材外围和切片槽内的作用。利用工件下降式多线锯，研究了在一系列切割条件下的切片特性。研究结果表明：(1)浆料填充在切片槽内，线材运行导致浆料向切片槽流动。(2)空气通过导线的运行进入切片槽内，在切片槽的浆料中可以观察到一些气泡和空气层。这些都是导致切片效率和精度降低的因素

The multi-wire saw is one of the methods used to slice large-sized silicon ingots. This slicing method uses a working fluid mixed abrasive grains, which is called slurry. In the case of a multi-wire saw of the workpiece descent-type, this slurry is supplied on the wire and carried to the processing area. As the workpiece is processed by slurry which enters between the wire and the workpiece, the slurry action is very important to the slicing efficiency and the accuracy of silicon wafers.In this study, the slurry actions on the periphery of the wire and inside the slicing groove are observed by a high-speed video camera. The slicing characteristics were studied under a series of slicing conditions using the workpiece descent-type multi-wire saw.From this study, the followings have become evident : (1) The slicing grooves are filled by the slurry, and the wire running brings about the slurry flow to the slicing grooves. (2) Air enters into the slicing grooves by the wire running, and some bubbles and air layer can be observed in the slurry of the slicing grooves. These are factors which contribute to lower slicing efficiency and accuracy