Multi-layer electronic circuit construct and method of making same

这项技术通过垂直排列苯并环丁烯(BCB)层中的嵌入电路元件，解决了与长导线轨道长度和长互连布线相关的问题。我们建议我们的技术改进当前使用的技术，因为它将增加信号传播，限制噪音并减少主板空间。目前减少空间的“最佳”方法包括创建堆叠在一起并随后连接的独立电路。我们的技术消除了创建独立电路和将它们连接在一起的麻烦。相反，我们创建了一种系统，其中3D电路嵌入到BCB本身中，该BCB安装在单个硅衬底上，可以不受限制地容纳电阻、晶体管、存储器、电容器以及其他电感、半导体、芯片等。这项技术将使电路能够更有效地运行，因为旅行距离更短。

This technology solves issues related to long conductor track length and long routing of interconnections by vertically aligning embedded circuit components in layers of Benzocyclobutene (BCB). We propose that our technology improves what is currently in use because it will increase signal propagation, limits noise and decrease motherboard space. Current 'optimal' methods of decreasing space involve the creation of separate circuits that are stacked together and subsequently connected. Our technology eliminates the creation of separate circuits and hassle of connecting them together. Instead, we have created a system in which 3D circuits are embedded in the BCB itself which is mounted on a single silicon substrate can accommodate without restriction resistors, transistors, memory, capacitors, as well as other inductors, semiconductors, chips and the like. This technology will enable circuits to operate more efficiently as a result of shorter travel distance.