Development of a super-resolution stochastical optical reconstruction raman microscope for online nanoscale electronic and photonics devices quality control. **

这项研究项目旨在开发新的传感策略，用于在线监测高价值电子和光电子芯片的制造。由于在复杂电路中布置的总是较小的构建块的持续集成，在测试和进一步集成到更大的设备中之前，监控这些器件的完整性变得至关重要。为此，利用具有足够空间分辨率的光学技术进行快速监测可能有助于识别结构或连接缺陷。我们建议开发一种基于拉曼随机光学重建显微镜(拉曼-STORM)的新的在线广场显微镜技术，该技术将提供20 nm的空间分辨率，非常适合在测试和集成设备之前识别现代电子和光电子芯片中的最小细节。风暴显微镜已被发展为荧光显微镜，并应用于生物学问题。在这里，我们建议将风暴模式应用于拉曼测量，这是一种特别适合于探测和识别集成电路中使用的材料(如掺杂硅)或更具破坏性的材料(如用于印刷电子产品的石墨烯、碳纳米管和分子油墨)的性质的光谱显微镜技术。对采集到的图像进行20纳米分辨率的快速采集和数字处理将产生颠覆性技术，该技术将适用于更好地控制高价值电子元件的质量，从而产生更好的生产率和效率。

This research project aims at developing new sensing strategies for online monitoring of the fabrication of high value electronic and optoelectronic chips. Due to the continuous integration of always smaller building blocks arranged in complex circuitry, it become critical to monitor the integrity of these devices prior to testing and further integration in larger apparatus. For this, rapid monitoring with optical techniques that possess sufficient spatial resolution can be of interest to identify structural or connection defects. We propose to develop a new online wide-field microscopy technique based on Raman-Stochastic Optical Reconstruction Microscopy (Raman-STORM) that will provide a spatial resolution of 20 nm, which is ideally suited to identify the smallest details in modern electronic and optoelectronic chips prior to their testing and integration in devices. STORM microscopy has been developed for fluorescence microscopy and applied to biological problems. Here we propose to apply STORM modalities to Raman measurements, a spectromicroscopy technique that is a particularly well suited technique to probe and identify the nature of materials used in integrated circuits such as doped silicon or more disruptive materials such as graphene, carbon nanotubes and molecular inks used in printed electronics. Fast acquisition and digital treatment of the collected images with 20 nm resolution will yield disruptive technology that will be applicable to better quality control of high value electronic component and therefore yield to a better production rate and efficiency.********