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Research of a High-speed Signal Transmission Scheme for Integrated Circuits

Research of a High-speed Signal Transmission Scheme for Integrated Circuits
一种集成电路高速信号传输方案的研究
批准号:
14350186
负责人:
ONODERA Hidetoshi
金额:
$10.88万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (B)
财政年份:
2002
资助国家:
日本
项目状态:
已结题
起止时间:
2002 至 2004

项目摘要

项目成果

ONODERA Hidetoshi的其他基金

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中文摘要
翻译
This research develops a design methodology to distribute GHz on chip high-speed signals to each portion of an LSI.The research topics are as follows.·A technique to analyze characteristics of wires for high-speed signal transmission。·A technique to analyze characteristics of power&ground-line structures。·A design scheme of CMOS circuits for a high-speed signal transmission。·Future performance predictions of on-chip high-speed signal transmission.We first evlauate on-chip transmission-lines with orthogonal ground wires by real chip measurement.Conventionally,orthogonal ground wires are ignored in the discussion about resistance and inductance。However measurement results and results of field solvers show orthogonal ground wires are not negligible in high frequency over 10 GHz。The characteristic of transmission-lines depends on frequency.However in circuit simulation,frequency-independent interconnect model is commonly used。Therefore the frequency used to model interconnects is…More one of the crucial problems.We develop a method to decide the single frequency based on the interconnect length.When we extract the interconnect characteristics,return current distribution strongly affects to the interconnect characteristics.We propose a method to select power/ground(p/g)wires that should be considered as return-path.We discuss an IR-drop aware p/g grid design and develop a method to insert p/g straps。The proposed method targets the circuits operating at low frequency where the inductance of p/g wires are negligible.As the operating frequency becomes higher,the inductance of the p/g wires has significant effect to the p/g noise。We evaluate p/g noise with various structure of p/g net and various operating condition。Experimental results show when on-chip inductance become significant in p/g noise.Current mode logic(CML)realizes on-chip high performance circuits.CML circuits can operate faster than conventional static CMOS logic circuits。We also develop a design method for high-speed multiplexer composed of CML and static CMOS。Designed multiplexers are verified by real chip measurement.Phase-Locked-Loop(PLL)is also important component in high-speed circuits。We analyze the performance trend of PLLs by improvement of the fabrication process.Conclusively we evaluate the performance of whole signaling system includes transmission-line,driver circuit and receiver circuit。Less:Less
英文摘要
This research develops a design methodology to distribute GHz on chip high-speed signals to each portion of an LSI. The research topics are as follows.・A technique to analyze characteristics of wires for high-speed signal transmission.・A technique to analyze characteristics of power & ground-line structures.・A design scheme of CMOS circuits for a high-speed signal transmission.・Future performance predictions of on-chip high-speed signal transmission.We first evlauate on-chip transmission-lines with orthogonal ground wires by real chip measurement. Conventionally, orthogonal ground wires are ignored in the discussion about resistance and inductance. However measurement results and results of field solvers show orthogonal ground wires are not negligible in high frequency over 10GHz. The characteristic of transmission-lines depends on frequency. However in circuit simulation, frequency-independent interconnect model is commonly used. Therefore the frequency used to model interconnects is … More one of the crucial problems. We develop a method to decide the single frequency based on the interconnect length. When we extract the interconnect characteristics, return current distribution strongly affects to the interconnect characteristics. We propose a method to select power/ground(p/g) wires that should be considered as return-path.We discuss an IR-drop aware p/g grid design and develop a method to insert p/g straps. The proposed method targets the circuits operating at low frequency where the inductance of p/g wires are negligible. As the operating frequency becomes higher, the inductance of the p/g wires has significant effect to the p/g noise. We evaluate p/g noise with various structure of p/g net and various operating condition. Experimental results show when on-chip inductance become significant in p/g noise.Current mode logic(CML) realizes on-chip high performance circuits. CML circuits can operate faster than conventional static CMOS logic circuits. We also develop a design method for high-speed multiplexer composed of CML and static CMOS. Designed multiplexers are verified by real chip measurement. Phase-Locked-Loop(PLL) is also important component in high-speed circuits. We analyze the performance trend of PLLs by improvement of the fabrication process.Conclusively we evaluate the performance of whole signaling system includes transmission-line, driver circuit and receiver circuit. Less
期刊论文(35)
专著(0)
科研奖励(0)
会议论文
土谷, 橋本, 小野寺: "VLSI配線の伝送線路特性を考慮した駆動力決定手法"情報処理学会論文誌. 43・5. 1338-1347 (2002)
土屋、桥本、小野寺:“考虑VLSI布线的传输线特性的驱动力确定方法”日本信息处理学会会刊43・5(2002)。
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通讯作者:
H.Hoshino, K.Okada, H.Onodera: "Design Optimization Methodology of On-Chip Spiral Inductor"Proc.SASIMI. (発表予定).
H.Hoshino、K.Okada、H.Onodera:“片上螺旋电感器的设计优化方法”Proc.SASIMI(待提交)。
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On-Chip Global Signaling by Wave Pipelining
通过 Wave Pipelines 进行片上全局信令
DOI: --
发表时间: 2004
期刊: Proc.of IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging
影响因子: --
作者: [M.Hashimoto, A.Tsuchiya, H.Onodera]
通讯作者: H.Onodera
A.Tsuchiya, M.Hashimoto, H.Onodera: "Representative Frequency for Interconnect R(f)L(f)C Extraction"IEICE Transactions on Fundamentals. E86-A,12. 2942-2951 (2003)
A.Tsuchiya、M.Hashimoto、H.Onodera:“互连 R(f)L(f)C 提取的代表性频率”IEICE 基本交易。
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18
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    • 财政年份:
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